WMSIC Electronic Components

TDK DEA165550BT-2230C2-H DEA165550BT

ModelDEA165550BT-2230C2-H
PackageSMD-3P,0.8x1.6mm
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TDK DEA165550BT-2230C2-H
Type
TDK
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
DEA165550BT-2230C2-H
Electronic Component
1
Package
SMD-3P,0.8x1.6mm
Electronic Component
RFFilter
Electronic Component
43dB
Electronic Component
0.03g
Electronic Component
50Ω
Electronic Component
1
Electronic Component
BM0095490824
Operating Temperature
40℃~+85℃
Electronic Component
0.9dB
Filter Type
Electronic Component
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:DEA165550BT-2230C2-H

一、产品简介

DEA165550BT-2230C2-H是一款由著名电子元器件制造商TDK生产的RF带通滤波器。其工作频率中心点为5.55GHz,具有800MHz的宽带特性,适合高频射频信号的选择性传输与处理。这款滤波器以其低插损(0.9dB)和紧凑的0603封装(1608公制)设计,使其在诸多射频应用中表现出色,是现代通信系统和无线设备中不可或缺的组件。

二、技术参数

  1. 中心频率:5.55GHz

    • 该频率适用于多种高频应用,包括5G基站、Wi-Fi及其他无线路由设备。
  2. 带宽:800MHz

    • 这表明该滤波器能够有效传递的频率范围广泛,确保信号在此范围内的传输效率和质量。
  3. 滤波器类型:带通

    • 带通滤波器允许特定频率范围的信号通过,阻止其他频率的信号,适合在多频段工作环境中隔离干扰。
  4. 插损:0.9dB

    • 插损是衡量滤波器在传输信号过程中的能量损失,0.9dB的插损显示出它在传输信号时的高效性,并可提升系统的整体性能。
  5. 安装类型:表面贴装型(SMD)

    • 表面贴装技术(SMT)使得DEA165550BT-2230C2-H能够在空间受限的电路板上轻松集成,适合高密度电路设计。
  6. 封装/外壳:0603(1608公制),3 PC 板

    • 封装尺寸为1.60mm x 0.80mm x 0.60mm(长宽高),该微型封装使其适用于各种紧凑型设备,确保系统设计的灵活性。

三、应用场景

DEA165550BT-2230C2-H带通滤波器具有广泛的应用前景,主要包括但不限于以下领域:

  1. 无线通信:

    • 该滤波器在5G网络、Wi-Fi(如802.11ac/ax)中起到重要作用,确保高频信号的清晰传输与效能。
  2. 射频识别(RFID):

    • 在RFID系统中使用该滤波器可提高信号的传输效率,增加读取距离和识别准确率。
  3. 卫星通信:

    • 卫星通讯设备对高频信号的要求非常高,DEA165550BT-2230C2-H可以有效地处理这些信号。
  4. 雷达系统:

    • 雷达信号处理需要精确的滤波,确保目标对象的有效检测和分析。

四、产品优势

  1. 高性能:通过优化设计和低插损特性,DEA165550BT-2230C2-H确保信号传输的高质量和高效率。

  2. 小型化设计:0603封装可以有效节省电路板空间,使其成为现代轻薄设备的理想选择。

  3. 易于集成:表面贴装型的设计使得该滤波器能够快速集成进入新产品的设计中,满足快节奏的市场需求。

  4. 可靠性:TDK作为知名品牌,在元器件的稳定性和耐用性方面享有良好声誉,DEA165550BT-2230C2-H符合严格的质量标准。

五、总结

DEA165550BT-2230C2-H是一款兼具高性能与高效率的RF带通滤波器,凭借其低插损、广泛的带宽以及小巧的0603封装,适用于多种高频应用场景。无论是在无线通信、射频识别还是先进的雷达系统中,该产品都将是实现信号处理的理想选择。对于需要可靠和高效高频信号的电路设计师而言,DEA165550BT-2230C2-H无疑是值得投资和推荐的解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.