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TDK MPZ1005S900HT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MPZ1005S900HT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MPZ1005S900HT000
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- Ferrite Bead
- Electronic Component
- ±25%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM0254006319
- Operating Temperature
- 55℃~+125℃
- Current
- 2.3A
- @Frequency
- 90Ω@100MHz
- Resistor(DCR)
- 38mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MPZ1005S900HT000 产品概述
一、产品简介
TDK 型号 MPZ1005S900HT000 为一颗贴片式磁珠（ferrite bead），封装为 0402（公制 1005），单通道。其在 100 MHz 时标称阻抗为 90 Ω，容差 ±25%；直流电阻（DCR）典型值 38 mΩ；额定直流电流 2.3 A；工作温度范围 -55 ℃ 到 +125 ℃。该产品用于针对高频干扰的串联抑制，兼顾低直流压降与较高的电流承载能力，适合空间受限的应用场合。
二、主要参数（要点）
- 阻抗：90 Ω @ 100 MHz，±25%
- 直流电阻：38 mΩ（典型）
- 额定电流：2.3 A（最大持续通过电流，应避免长期接近极限导致磁性材料退化或温升）
- 通道数：1（单线串联型）
- 封装：0402（适合高密度 PCB 设计）
- 工作温度：-55 ℃ ～ +125 ℃
三、典型应用场景
- 电源线上高频杂散噪声抑制（DC-DC 输出、LDO 输入/输出）
- 移动设备、可穿戴设备和物联网终端的 EMI/ESD 前端滤波（在满足其他规范前提下）
- USB、影音与射频模块的去耦与干扰隔离
- 主板与子板之间的高频噪声抑制，尤其当要求低压降和较大直流电流时
四、设计要点与使用建议
- 串联安装于噪声源与负载之间：磁珠在直流下呈低阻抗以保持电源稳定，在高频段呈高阻抗以衰减噪声。
- 考虑直流偏置效应：磁珠阻抗在高直流电流或高温下可能下降，应在实际工作电流条件下验证滤波效果。
- 与旁路电容配合使用：在电源滤波网路中，磁珠与不同频段的旁路电容配合可形成多级滤波，扩大抑制频带。
- 布局注意：尽量靠近噪声源或进口处放置，避免在磁珠两端形成环路，通过短走线和良好接地提高效果。
- 温升与热管理：在接近额定电流时检查温升，必要时采用更大封装或并联多颗分担电流。
五、封装与生产注意事项
- 0402 尺寸适合高密度布板，但在手工焊接和检修时较为脆弱，注意机械应力保护。
- 采用推荐的回流焊工艺，遵循制造商的温度曲线以避免材料性能退化。
- 存储与贴装时注意静电与湿度控制，避免因湿度吸收导致回流过程发生裂纹。
六、选型参考与替代考虑
- 若工作电流或阻抗要求更高，可考虑更大封装或多通道滤波器（共模电感/共模滤波器）以补充功能。
- 当需要更稳定的低频抑制，滤波方案中应结合电感或 Pi 型网络设计，单颗磁珠主要用于高频抑制。
七、总结
MPZ1005S900HT000 以其 90 Ω @100 MHz 的高频阻抗、低 DCR 与 2.3 A 的电流承载能力，在体积受限但对高频 EMI 抑制有较高要求的电源与信号链路中表现出色。合理的布局与匹配电路能发挥其最佳效果，选择时需综合考虑工作电流、温升与目标抑制频谱。若需在具体电路中应用，可在实际工况下做阻抗-电流-温度特性验证以确定最终方案。
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