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TDK MMZ1608R102ATD25
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MMZ1608R102ATD25
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MMZ1608R102ATD25
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- Ferrite Bead
- Electronic Component
- ±25%
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM0228288744
- Operating Temperature
- 55℃~+125℃
- Current
- 400mA
- @Frequency
- 1kΩ@100MHz
- Resistor(DCR)
- 500mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMZ1608R102ATD25 产品概述
一、产品简介
MMZ1608R102ATD25 是 TDK 推出的一款表面贴装型磁珠抑制元件，封装尺寸为 0603（1608 公制）。其在高频段具有较高的阻抗特性，可有效抑制 100MHz 及以上频率的共模/差模干扰，适用于移动通信、消费电子、工控与汽车电子的射频及电源去耦场合。
二、主要参数
- 直流电阻（DCR）：500 mΩ（典型值）
- 工作温度：-55℃ ~ +125℃
- 阻抗：1 kΩ @ 100 MHz
- 通道数：1（单通）
- 阻抗误差：±25%
- 额定电流：400 mA（直流通过能力）
- 品牌：TDK
- 封装：0603
三、特性与优势
- 高频抑制能力强：在 100MHz 时阻抗可达 1 kΩ，能有效吸收和衰减射频干扰。
- 单通设计：适合对单一信号线或电源线进行简单、直接的 EMI 抑制。
- 宽温区可靠性好：-55℃ 至 +125℃ 的工作温度范围，适用于多种恶劣环境。
- 小型化封装：0603 封装有利于高密度 PCB 布局和自动贴装生产。
四、典型应用
- 手机、平板、智能穿戴等消费类终端的射频与电源滤波
- 电源线、敏感信号线的 EMI 抑制与去耦
- 汽车电子、通信基站和工控设备中的高频噪声抑制
五、使用建议
- 电流与温升：额定电流 400 mA 为长期安全工作值，若实际电流接近或超过该值，请评估温升和直流压降（DCR），必要时选择电流余量更大的型号或并联使用。
- 布局建议：紧靠干扰源或敏感输入端放置，尽量缩短与接地的回流路径，可结合片式电容形成低频+高频复合滤波。
- 焊接与可靠性：支持常规回流焊工艺，建议遵循制造商的焊接温度曲线以保证性能稳定。
六、选型提示
- 若系统需更低直流压降或更大电流容量，应考虑更低 DCR 或更大封装尺寸的磁珠或共模电感。
- 阻抗误差 ±25% 为常规公差，若对频域响应有严格要求，建议查看实际频率特性曲线或获取器件样片进行验证。
以上为 MMZ1608R102ATD25 的简洁概述与工程使用建议，具体电气与机械数据请参阅 TDK 官方数据手册以获得完整规范与性能曲线。
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