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TDK MLG1005S39NHTD25
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TDK MLG1005S39NHTD25
- Type
- TDK
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG1005S39NHTD25
- Electronic Component
- 1
- Package
- SMD
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- ±3%
- Electronic Component
- 0.012g
- Inductor
- 39nH
- Electronic Component
- 1
- Factor
- 8@100MHz
- Electronic Component
- BM0265523202
- Electronic Component
- AEC-Q200
- Current
- 250mA
- Frequency
- 1.2GHz
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG1005S39NHTD25 产品概述
一、产品简介
MLG1005S39NHTD25 为 TDK 推出的 39 nH 叠层无屏蔽贴片电感，封装尺寸为 0402（1005 公制）。该器件精度为 ±3%，额定直流电流 250 mA，适合在对体积、可靠性有较高要求的紧凑电子设计中用作高频旁路、阻抗调整与共模干扰抑制元件。产品满足 AEC-Q200 车规等级，适用于汽车电子与工业级环境。
二、主要参数
- 电感值：39 nH，公差 ±3%
- 额定电流：250 mA（ICL/sat 需在实际应用中考虑余量）
- 直流电阻（DCR）：约 650 mΩ（典型值），最大值 ≤ 1 Ω（参考器件总体描述）
- 品质因数（Q）：8 @ 100 MHz
- 自谐振频率（SRF）：约 1.2 GHz
- 结构类型：多层叠层电感（无屏蔽）
- 封装：0402（1005 公制）
- 认证：车规 AEC-Q200
三、特性与优势
- 小型化：0402 封装极大节省 PCB 面积，适配消费类、移动与车载紧凑设计。
- 高频性能：SRF 达 1.2 GHz，Q 值在 100 MHz 附近能保持中等水准，适用于 RF 旁路与滤波场景。
- 车规可靠性：通过 AEC-Q200 认证，温度循环、震动及湿热等可靠性测试更适合苛刻环境。
- 低成本批量制造：多层叠层工艺适合大规模 SMT 贴装，良好的一致性与可重复性。
- 无屏蔽结构带来较低磁耦合，便于在密集布线中使用，但需留意磁场敏感元件邻近布置。
四、典型应用
- 汽车电子信号线滤波与去耦（车载信息娱乐、传感器前端）
- 移动通信与无线模块中的 EMI 抑制与匹配网络
- 电源噪声抑制与小电流电源滤波
- 精密测量与高频信号路径中的阻抗调节
五、封装与可靠性说明
0402（1005）封装适合自动贴片生产线，但体积极小需注意贴装精度与回流焊温度曲线。无屏蔽叠层结构在高磁场或强耦合场合可能引起干扰，布板时建议与敏感器件保持适当间距或采用屏蔽方案。器件符合 AEC-Q200，可通过汽车级环境应力验证。
六、选型建议与注意事项
- 电流裕量：250 mA 为额定值，实际使用时建议留出饱和与温升裕度，避免长期接近额定电流。
- 频段匹配：工作频率接近或高于 SRF 时电感不再表现理想感抗，应改用更高 SRF 或其他滤波元件。
- DCR 与损耗：DCR ≈ 0.65 Ω，影响直流压降与功率耗散，低电阻需求场合应选用更大封装或低 DCR 型号。
- 布局焊接：遵循 TDK 推荐焊盘尺寸与回流工艺，避免因过热或焊接不良影响可靠性。
七、结语
MLG1005S39NHTD25 以其小尺寸、符合车规的可靠性和适度的高频特性，适合在空间受限且要求稳定性的应用中作为高频和 EMI 抑制元件。在选型与布板时关注电流裕度、工作频段与焊接工艺，可发挥该器件最佳性能。若需更高电流或更低 DCR 的替代，请考虑更大尺寸或不同材料的同类产品。
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