WMSIC Electronic Components

TDK MMZ1005A601ETD25

ModelMMZ1005A601ETD25
Package0402
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TDK MMZ1005A601ETD25
Type
TDK
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
MMZ1005A601ETD25
Electronic Component
1
Package
0402
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.012g
Electronic Component
1
Channel Count
1
Electronic Component
BM0265606272
Current
300mA
@Frequency
600Ω@100MHz
Resistor(DCR)
800mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TDK MMZ1005A601ETD25 铁氧体磁珠产品概述

一、产品定位与核心用途

TDK MMZ1005A601ETD25是一款多层片式铁氧体磁珠,专为高频噪声抑制设计,属于TDK主流片式磁珠系列中的小封装型号。其核心用途是在电子电路中过滤特定频率范围的干扰信号,同时保持直流信号的低损耗传输,广泛适配小型化、低功耗的电子设备。

二、基础参数详细解析

该磁珠的关键参数明确了性能边界,需重点关注以下几点:

  1. 特征阻抗与误差:阻抗为600Ω@100MHz,误差±25%。磁珠阻抗是频率依赖型(非直流电阻),仅在100MHz左右达到600Ω峰值,对该频段附近噪声抑制最优;±25%误差是磁珠类器件常规公差,满足大多数工程精度需求。
  2. 直流电阻(DCR):800mΩ(毫欧)。DCR是磁珠的直流导通电阻,数值极低意味着直流信号传输时功耗小、压降可忽略,适合电池供电的便携设备。
  3. 额定电流:300mA(毫安)。这是磁珠允许的最大直流工作电流,若实际电流超过该值,磁珠会因磁饱和导致阻抗急剧下降,失去噪声抑制能力,需严格匹配电路电流。
  4. 通道数:1通道(单路)。仅支持单路信号/电源线路的噪声抑制,不具备多路集成功能。

三、封装与物理特性

该磁珠采用0402封装(公制对应1005),是电子行业常见的小型化封装:

  • 尺寸(英寸/公制):0402英寸(约1.0mm×0.5mm),厚度约0.5mm(典型值);
  • 封装优势:小体积适配高密度PCB设计,尤其适合智能手机、可穿戴设备等对空间要求苛刻的产品;
  • 焊接兼容性:支持回流焊、波峰焊等常规贴片工艺,符合RoHS环保标准(TDK主流磁珠均满足)。

四、典型应用场景

基于小封装、低功耗、高频抑制的特点,该磁珠主要应用于:

  1. 消费电子便携设备:智能手机、平板的射频模块(蓝牙、WiFi)、电源管理电路(电池充电线路)的噪声过滤;
  2. 可穿戴设备:智能手表、手环的传感器模块(心率、加速度计)、无线通信线路的干扰抑制;
  3. 小型通信模块:IoT设备(智能家居传感器)、低功耗蓝牙模块的信号去耦;
  4. 工业低功耗电路:小型工业控制器的传感器接口、通信线路的噪声隔离(需确认电流≤300mA)。

五、关键性能优势

相比同类小封装磁珠,该产品具备以下优势:

  1. 高频噪声针对性强:600Ω@100MHz的阻抗峰值,精准覆盖100MHz左右的常见干扰频段(如WiFi二次谐波、蓝牙噪声);
  2. 低功耗无损耗:800mΩ的DCR远低于同阻抗级别的磁珠,不会因直流压降影响电池续航;
  3. 高可靠性:TDK成熟的多层片式工艺,确保焊接稳定性和长期工作可靠性(MTBF符合行业标准);
  4. 环境适应性:支持-40℃至+85℃的工作温度范围,适配大多数电子设备的环境需求。

六、选型与使用注意事项

为确保性能发挥,需注意以下要点:

  1. 电流匹配优先:电路直流电流必须≤300mA,若需更高电流,需选择同封装的高额定电流型号(如MMZ1005B系列);
  2. 频率范围确认:若噪声频率偏离100MHz(如低于50MHz或高于200MHz),需查阅TDK官方阻抗曲线,确认抑制效果是否满足需求;
  3. 焊盘设计合规:0402封装需匹配PCB焊盘尺寸(典型焊盘:0.6mm×0.4mm),避免焊盘过大导致桥连或过小导致虚焊;
  4. 避免串并联错误:单通道设计,若需多路抑制,需分别贴装,不可并联(降低阻抗)或串联(增加DCR)。

总结

TDK MMZ1005A601ETD25是一款针对100MHz频段噪声抑制、小封装低功耗的片式铁氧体磁珠,完美适配便携设备、可穿戴等高密度电路的噪声过滤需求。其参数明确、工艺可靠,是工程设计中高频噪声抑制的实用选型。

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