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TDK MLG1005S68NHTD25
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLG1005S68NHTD25
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLG1005S68NHTD25
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- ±3%
- Electronic Component
- 0.012g
- Inductor
- 68nH
- Electronic Component
- 1
- Factor
- 8@100MHz
- Electronic Component
- BM0262574049
- Electronic Component
- AEC-Q200
- Current
- 200mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLG1005S68NHTD25 产品概述
一、产品简介
MLG1005S68NHTD25 为 TDK 车规级（AEC‑Q200）叠层贴片电感，封装规格为 0402，电感值 68 nH，公差 ±3%。该器件针对高密度表贴电路设计，兼顾射频性能与小型化需求，适用于对体积和一致性有严格要求的商业及汽车电子应用。
二、关键参数
- 电感值：68 nH ±3%
- 额定电流：200 mA
- 直流电阻（DCR）：870 mΩ
- 品质因数（Q）：8（@100 MHz）
- 自谐振频率（SRF）：1.1 GHz
- 类型：叠层电感（MLI）
- 封装：0402（适配自动贴装）
- 可靠性等级：AEC‑Q200（车规）
三、性能与适用频段
该器件 Q 值在 100 MHz 范围内表现中等（Q≈8），自谐振频率 1.1 GHz，适合用于低至中频射频电路的阻抗匹配、谐振/陷波网络以及 EMI 抑制场合。由于 DCR 较高，适合以阻抗量为主的应用场景而非追求最低串联电阻的电源滤波用途。
四、典型应用
- 射频匹配网络与滤波器（移动终端、无线模块）
- 信号链中的陷波/谐振电路
- EMI 抑制与射频隔离元件
- 汽车电子中的小信号滤波与射频前端模块（得益于 AEC‑Q200 认证）
五、选型与使用注意
- 工作频段应低于 SRF，接近或超过 SRF 时电感行为会失去预期；建议在目标频率点进行实际测量验证。
- DCR 与额定电流会影响功耗和温升，接近 200 mA 长期工作时建议进行热仿真或实测并考虑降额使用。
- 在高频应用中，布局对性能影响显著：尽量缩短与相邻器件的连线，避免不必要的串联寄生电感或电容。
- 如用于汽车及严苛环境，参考制造商的温度循环、湿热等可靠性数据并遵循回流焊工艺规范。
六、封装与装配
0402 贴片封装适配主流 SMT 自动贴装与回流焊流程。建议采用卷带供料并参照元件供应商给出的回流焊曲线与储存/湿敏等级（若有）进行贴装前处理，以保证焊接可靠性与电气性能一致性。
七、总结
MLG1005S68NHTD25 以小型 0402 封装实现 68 nH 的电感值，具备车规可靠性认证，适合在体积受限且对频率特性有要求的射频与 EMI 抑制场景使用。设计时应特别关注 DCR、额定电流与工作频率对实际电路性能的影响，并在关键应用处进行实测验证，以获得最佳的工作稳定性与一致性。若需进一步的频率响应曲线、温度特性或封装尺寸图，建议参考 TDK 的详细产品规格书与应用手册。
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