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TDK NTCG104BH103JT1
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK NTCG104BH103JT1
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- NTCG104BH103JT1
- Electronic Component
- 1
- Electronic Component
- 0.5mm
- Package
- 0402
- Electronic Component
- NTCThermistor Resistor
- Electronic Component
- 0.012g
- Electronic Component
- 1mm
- Electronic Component
- 10kΩ
- Electronic Component
- 0.5mm
- Electronic Component
- 1
- B
- ±3%
- Electronic Component
- BM0258781217
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TDK NTCG104BH103JT1 NTC热敏电阻产品概述
一、产品基本识别信息
TDK NTCG104BH103JT1是一款负温度系数（NTC）热敏电阻，属于TDK热敏电阻产品线中的小体积高精度型号，核心标识如下：
- 品牌：TDK（日本东电化，全球电子元器件领先制造商）
- 型号：NTCG104BH103JT1
- 类型：NTC热敏电阻（温度升高时阻值呈负指数规律下降）
- 封装：0402（英制规格，对应公制1005，即1.0mm×0.5mm尺寸）
二、核心电气参数
该型号电气性能参数明确，支撑精准温度测量与控制需求：
1. 标称阻值与精度
- 标称阻值：25℃环境下为10kΩ
- 阻值精度：±5%（满足多数工业、消费电子场景的基础精度要求）
2. B值特性（温度系数）
B值是NTC热敏电阻的核心温度系数，反映阻值随温度变化的速率，该型号B值精度为±3%，不同温度区间B值如下：
温度区间（25℃/X℃） B值（K） 25℃/50℃ 4067 25℃/75℃ 4092 25℃/85℃ 4100 25℃/100℃ 4110 （注：B值计算公式为 ( B = \frac{T_1T_2}{T_2-T_1} \ln(\frac{R_2}{R_1}) )，其中 ( T_1=298.15K )、( T_2 ) 为对应温度绝对温度，( R_1/R_2 ) 为对应阻值）3. 功率与电流规格
- 额定功率：100mW（25℃下最大允许功耗）
- 最大稳态电流（25℃）：310μA（长期工作电流上限）
- 耗散系数：1mW/℃（每升高1℃，耗散功率增加1mW，需考虑散热设计）
4. 工作温度范围
- 工作温度：-40℃ ~ +125℃（覆盖低温户外、高温工业场景）
三、封装与物理尺寸
采用0402/1005封装，是小型化电子设备主流规格，物理尺寸：
- 长度：1.0mm
- 宽度：0.5mm
- 高度：0.5mm 小体积适配高密度PCB布局，助力终端产品缩小尺寸，适合可穿戴、智能手机等空间敏感场景。
四、典型应用场景
基于特性，该型号可应用于：
- 消费电子：手机、平板的电池/CPU温度监测、过温保护；
- 可穿戴设备：智能手表、手环的环境/人体温度检测；
- 工业控制：电机、电源模块、传感器节点的温度监测；
- 电源管理：开关电源、LED驱动的过温保护电路；
- 汽车辅助：车载小功率设备温度检测（宽温特性适配非关键汽车场景）。
五、关键性能优势
- 高精度一致性：阻值±5%、B值±3%，温度-阻值曲线稳定，便于补偿电路设计；
- 宽温区稳定：-40℃~125℃覆盖极端环境，满足户外、工业需求；
- 小体积高密度：0402封装适配高密度PCB，助力产品小型化；
- 低功耗可靠：100mW功率、310μA电流，满足低功耗电路长期工作；
- TDK品质保障：行业领先品牌，产品一致性经市场验证。
六、应用设计注意事项
- 电流限制：工作电流不超310μA（25℃），避免过流导致阻值漂移；
- 温度极限：禁止超125℃/低于-40℃长期工作，短期冲击遵循官方规格；
- 焊接工艺：回流焊温度需符合TDK参数，避免热应力影响B值；
- 温度补偿：根据实际工作温度区间选择对应B值计算，提升测量精度。
如需更详细参数，可参考TDK官方 datasheet 补充终端应用细节。
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