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TDK C1005C0G2A102JT000E
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TDK C1005C0G2A102JT000E
- Type
- TDK
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- C1005C0G2A102JT000E
- Electronic Component
- 1
- Electronic Component
- 1nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0257242308
- Electronic Component
- C0G
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TDK C1005C0G2A102JT000E 产品概述
一、产品简介
TDK 型号 C1005C0G2A102JT000E 为贴片多层陶瓷电容（MLCC），标称电容值 1nF（102），容差 ±5%（J），额定电压 100V，介质为 C0G（也称 NP0），封装为 0402（公制 1005）。该型号主打高稳定性、低温漂与低损耗，适用于对容值精度与温度特性要求严格的电路。
二、主要性能特点
- 温度系数 C0G：接近零温度系数，典型变化极小（近 0 ±30 ppm/°C），适合高精度场合。
- 容值与电压：1nF、100V 额定电压，能在较高工作电压下保持稳定性能。
- 低介质损耗与高 Q 值：适合高频与射频前端、滤波与谐振电路。
- 低电压依赖性：C0G 类陶瓷对直流偏置敏感度极低，适用于定时与采样电路。
- 小尺寸封装 0402：适配高密度贴装，利于轻薄化与空间受限设计。
三、典型应用场景
- 高频滤波、耦合与去耦电路
- 振荡器、定时与相位同步电路的频率决定元件
- ADC/DAC 前端与采样保持电路（要求低温漂与高稳定性）
- 精密模拟电路与传感器接口
- 通信设备、仪器仪表以及消费电子设备中对稳定性有较高要求的部分
四、使用与焊接建议
- 焊接：遵循 TDK 提供的回流焊工艺参数（以无铅回流为主），避免超过厂商规定的峰值温度与保温时间。
- 贴装：0402 尺寸对焊膏量与贴装精度敏感，建议按厂商推荐的焊盘尺寸与焊膏模板开口设计。
- 机械应力：陶瓷电容易碎，应避免在 PCB 弯曲或强烈机械应力下焊接，采用适当的贴片间距与过孔缓冲设计可降低裂纹风险。
- 清洗与回流次数：遵守材料兼容性，控制清洗溶剂及回流次数以保证长期可靠性。
五、选型与替代建议
若需同类性能且不同品牌替代，可查找其他厂商 C0G/NP0 介质、0402 封装、1nF、100V、±5% 的 MLCC。选型时注意比较温漂规格、额定电压、可靠性验证（如有无 AEC-Q200 要求）及包装方式以确保生产一致性。
六、总结
TDK C1005C0G2A102JT000E 以其 C0G 介质的优异温度稳定性、低损耗与良好频率特性，适合对精度和长期稳定性有较高要求的电路。设计与生产时应遵循厂商推荐的焊接与贴装规范，以确保器件性能与可靠性。若需进一步的数据（如等效串联电阻 ESR、耐压试验或回流曲线），建议参考 TDK 官方数据手册。
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