Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK NTCG104EF104HT1X
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK NTCG104EF104HT1X
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- NTCG104EF104HT1X
- Electronic Component
- 1
- Electronic Component
- 0.5mm
- Package
- 0402
- Electronic Component
- NTCThermistor Resistor
- Electronic Component
- 0.011g
- Electronic Component
- 1mm
- Electronic Component
- 100kΩ
- Electronic Component
- 0.5mm
- Electronic Component
- 1
- B
- ±1%
- Electronic Component
- BM0262575740
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TDK NTCG104EF104HT1X NTC热敏电阻产品概述
一、核心参数总览
该产品为TDK推出的高精度NTC热敏电阻，核心参数如下：
- 标称阻值：25℃时为100kΩ（型号后缀“104”对应10^4 Ω）；
- B值系列（以25℃为基准温度）：
- 25℃/50℃：4250K；
- 25℃/75℃：4293K；
- 25℃/85℃：4308K；
- 25℃/100℃：4327K；
- 功率规格：最大耗散功率100mW；
- B值精度：±1%（温度-电阻特性一致性优异）；
- 工作温度范围：-40℃~+125℃（宽温覆盖极端环境）；
- 耗散系数：1mW/℃（热损耗与温度变化的线性关系明确）；
- 封装与尺寸：0402表面贴装封装，物理尺寸为长1mm×宽0.5mm×高0.5mm。
二、关键性能特性
- 高精度温度检测：B值精度±1%，25℃阻值稳定，可有效降低温度计算误差，满足对温度精度要求较高的场景；
- 宽温环境适应性：覆盖-40℃（低温户外）至+125℃（高温工业/车载），能适应不同地域与工况的温度变化；
- 小体积高密度设计：0402封装（公制1005）体积紧凑，可大幅节省PCB空间，适合便携式设备、小型化模块的布局优化；
- 稳定热特性：耗散系数1mW/℃，功率损耗与温度变化的对应关系清晰，便于电路设计中进行热补偿与功耗控制；
- 高可靠性：TDK品牌保障，产品符合工业级应用的可靠性要求，可长期稳定工作。
三、封装与尺寸说明
该产品采用0402表面贴装封装（SMT），属于小型化贴片类型，具体尺寸为：
- 长度：1.0mm（±0.1mm，常规封装公差）；
- 宽度：0.5mm（±0.1mm）；
- 高度：0.5mm（±0.1mm）。
封装形式兼容自动化SMT生产流程，可提升生产效率；同时小体积利于PCB多层板、高密度电路的布局，减少设计约束。
四、典型应用场景
结合参数特性，该产品适用于以下领域：
- 消费电子：智能手机、智能手表的电池温度监测，充电电路的温度补偿；
- 工业控制：PLC模块、传感器节点的环境温度检测，电机、电源模块的热保护；
- 汽车电子：车载空调温度控制，电池管理系统（BMS）的温度监测（宽温适应车载环境）；
- 医疗设备：小型医疗仪器的体温检测，设备内部温度闭环控制；
- 智能家居：智能 thermostat、冰箱/空调的温度传感与调控。
五、产品优势总结
- 精度突出：B值±1%、阻值稳定，温度检测误差控制在较低范围；
- 环境适应广：-40℃~+125℃覆盖极端温度场景，无需额外冗余设计；
- 空间友好：0402封装适合小型化、高密度设计，满足便携设备需求；
- 品牌可靠：TDK在电子元器件领域的技术积累，保障产品长期稳定性；
- 设计便利：热特性明确，便于电路热管理与温度补偿算法的开发。
该产品凭借高精度、宽温范围与小体积优势，可成为各类温度传感与补偿场景的理想选择，尤其适合对空间与精度要求严格的应用。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
