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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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MHQ1005P27NJT000是TDK推出的高频小型化贴片电感,采用1006(对应英制0402)封装,专为高密度射频电路、高速数字链路及便携设备设计。该型号兼顾电气性能与尺寸优势,适配消费电子、物联网、无线通信等领域的轻量化、低损耗需求,是TDK电感产品线中针对中高频应用的核心型号之一。
标称电感值为27nH,精度±5%,满足多数射频匹配、滤波电路对电感偏差的要求——无需额外补偿即可实现稳定的阻抗匹配,降低电路设计复杂度。
在250MHz测试频率下Q值为20。Q值反映电感“储能/损耗比”,高Q值意味着高频下能量损耗更小,可提升射频电路的信号质量(如减少插入损耗、优化增益)。
1.7GHz(电感等效为纯电阻的固有频率)。工作频率应远低于SRF以保证电感特性,该型号适配1GHz以下的射频场景(如5G sub-6GHz的600MHz~1.7GHz子频段)。
采用1006(0402)贴片封装,尺寸仅为1.0mm×0.5mm(长×宽),厚度约0.5mm(典型值),大幅节省PCB布局空间,适配无线耳机、智能手表等对尺寸要求严苛的便携设备。
封装符合IPC标准,支持回流焊工艺,适配自动化贴装生产线,批量生产一致性高;同时符合RoHS、REACH环保指令,无铅焊接兼容性好。
蓝牙5.0/5.1、WiFi 6/6E、5G sub-6GHz等射频前端的匹配网络、滤波电路,用于信号阻抗匹配与杂波抑制。
DDR4/DDR5内存模组、PCIe 4.0/5.0等高速信号链路的去耦电感,减少电源噪声对信号完整性的干扰。
LoRa、ZigBee等低功耗射频模块的电感元件,兼顾小型化与低损耗,适配电池供电的IoT设备。
智能手机、智能穿戴(手表/手环)、无线耳机等产品的射频电路,满足轻量化、小型化设计需求。
TDK自研的高频低损耗磁芯材料+高精度绕制工艺,确保产品具备:
若需调整参数,可参考TDK同系列型号:
MHQ1005P27NJT000凭借“小型化+高频低损耗+高可靠性”的综合优势,成为射频及高速电路设计中的优选电感元件,适配多领域的轻量化、高性能需求。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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