WMSIC Electronic Components

TDK MHQ1005P27NJT000

ModelMHQ1005P27NJT000
Package1006(0402)
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TDK MHQ1005P27NJT000
Type
TDK
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
MHQ1005P27NJT000
Electronic Component
1
Package
1006(0402)
Electronic Component
SMD Inductor
Electronic Component
±5%
Electronic Component
0.012g
Inductor
27nH
Electronic Component
1
Factor
20@250MHz
Electronic Component
BM0058431003
Current
230mA
Frequency
1.7GHz
Resistor(DCR)
660mΩ

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TDK MHQ1005P27NJT000 贴片电感产品概述

一、产品基本定位

MHQ1005P27NJT000是TDK推出的高频小型化贴片电感,采用1006(对应英制0402)封装,专为高密度射频电路、高速数字链路及便携设备设计。该型号兼顾电气性能与尺寸优势,适配消费电子、物联网、无线通信等领域的轻量化、低损耗需求,是TDK电感产品线中针对中高频应用的核心型号之一。

二、核心电气性能参数解析

1. 电感量与精度

标称电感值为27nH,精度±5%,满足多数射频匹配、滤波电路对电感偏差的要求——无需额外补偿即可实现稳定的阻抗匹配,降低电路设计复杂度。

2. 额定电流与直流电阻(DCR)

  • 额定电流:230mA(持续工作不超过温度上升限值的最大电流);
  • DCR:660mΩ(电感线圈的直流电阻)。
    低DCR设计可显著降低功率损耗((P=I^2 \times DCR)),减少电路发热,尤其适合电池供电的低功耗设备。

3. 品质因数(Q值)

在250MHz测试频率下Q值为20。Q值反映电感“储能/损耗比”,高Q值意味着高频下能量损耗更小,可提升射频电路的信号质量(如减少插入损耗、优化增益)。

4. 自谐振频率(SRF)

1.7GHz(电感等效为纯电阻的固有频率)。工作频率应远低于SRF以保证电感特性,该型号适配1GHz以下的射频场景(如5G sub-6GHz的600MHz~1.7GHz子频段)。

三、封装与物理特性

采用1006(0402)贴片封装,尺寸仅为1.0mm×0.5mm(长×宽),厚度约0.5mm(典型值),大幅节省PCB布局空间,适配无线耳机、智能手表等对尺寸要求严苛的便携设备。
封装符合IPC标准,支持回流焊工艺,适配自动化贴装生产线,批量生产一致性高;同时符合RoHS、REACH环保指令,无铅焊接兼容性好。

四、典型应用场景

1. 无线通信终端

蓝牙5.0/5.1、WiFi 6/6E、5G sub-6GHz等射频前端的匹配网络、滤波电路,用于信号阻抗匹配与杂波抑制。

2. 高速数字电路

DDR4/DDR5内存模组、PCIe 4.0/5.0等高速信号链路的去耦电感,减少电源噪声对信号完整性的干扰。

3. 物联网(IoT)模块

LoRa、ZigBee等低功耗射频模块的电感元件,兼顾小型化与低损耗,适配电池供电的IoT设备。

4. 消费电子便携设备

智能手机、智能穿戴(手表/手环)、无线耳机等产品的射频电路,满足轻量化、小型化设计需求。

五、品质与可靠性优势

TDK自研的高频低损耗磁芯材料+高精度绕制工艺,确保产品具备:

  • 高一致性:批量电感量偏差控制在±5%以内,适配量产需求;
  • 宽温可靠性:通过-40℃~+85℃温度循环测试,满足工业级环境要求;
  • 焊接稳定性:符合AEC-Q200标准(部分批次),适合汽车电子等严苛场景;
  • 低损耗特性:250MHz下Q值稳定20,高频性能优于同类竞品。

六、选型与替换参考

若需调整参数,可参考TDK同系列型号:

  • 电感量调整:MHQ1005P18NJT000(18nH)、MHQ1005P33NJT000(33nH);
  • 电流升级:MHQ1005P27NJZ000(300mA);
  • 尺寸适配:1608(0603)封装型号(如MHQ1608P27NJT000)。

MHQ1005P27NJT000凭借“小型化+高频低损耗+高可靠性”的综合优势,成为射频及高速电路设计中的优选电感元件,适配多领域的轻量化、高性能需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.