WMSIC Electronic Components

TDK MLK1005S8N2JT000

ModelMLK1005S8N2JT000
Package0402
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TDK MLK1005S8N2JT000
Type
TDK
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
MLK1005S8N2JT000
Electronic Component
1
Package
0402
Electronic Component
SMD Inductor
Electronic Component
±5%
Electronic Component
0.012g
Inductor
8.2nH
Electronic Component
1
Factor
7@100MHz
Electronic Component
BM0262575916
Current
350mA
Frequency
5GHz
Resistor(DCR)
210mΩ

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MLK1005S8N2JT000 产品概述

一、产品简介

MLK1005S8N2JT000 为 TDK 出品的 0402(1005公制)贴片电感,标称电感值 8.2 nH,公差 ±5%。该器件体积极小,适用于空间受限的高频电路与便携设备中,兼顾射频性能与功率能力,是常见的射频匹配、滤波与偏置网络元件之一。

二、主要技术指标

  • 电感值:8.2 nH,精度 ±5%
  • 额定直流电流:350 mA(额定工作电流,超过可能引起电感值下降或发热)
  • 直流电阻(DCR):210 mΩ(影响插损与能量耗散)
  • 品质因数(Q):7 @ 100 MHz(中等 Q 值,适合宽带或一般射频用途)
  • 自谐振频率(SRF):5 GHz(在 SRF 以下表现为电感性,在此频率附近及以上行为发生变化)
  • 封装:0402(毫米制 1005),表面贴装

三、性能特点

  • 极小封装:0402 尺寸适合高密度 PCB 布局与轻薄型终端设备。
  • 高频特性:SRF 达 5 GHz,适用于 GHz 级别的高频电路设计(在 SRF 以下使用可获得良好电感特性)。
  • 功率与热稳定:350 mA 的额定电流适合小电流偏置或射频路径,需考虑热升与饱和效应。
  • 损耗与匹配:DCR 较高及 Q 值中等,表明在需要低插损、高 Q 的谐振回路中应谨慎选用;更适合阻抗匹配、阻尼或去耦场合。

四、典型应用场景

  • 射频阻抗匹配元件、反馈与偏置网络。
  • 高频滤波器(串联/并联)与阻尼电路。
  • 天线匹配电路、收发模块内部的短路/隔离元件。
  • 移动设备、无线模块、蓝牙/Wi‑Fi/物联网终端等空间受限的应用。

五、选型与使用建议

  • 留有电流裕量:额定电流 350 mA 为安全工作参考,若工作电流接近或超过该值,应选用额定电流更高的型号以避免电感下降或热失效。
  • 考虑插损与 Q:DCR 210 mΩ 与 Q=7 在 100 MHz 下表明存在一定损耗,应用于需要低损耗高 Q 的滤波或谐振回路时需评估影响。
  • PCB 布局:短且对称的过孔与走线可降低寄生电感电阻;在高频路径上尽量缩短焊盘到器件的回流路径。
  • 测试与测量:测量时应使用校准的网络分析仪并注意夹具与焊盘寄生,实测电感值与 Q 在装配后可能与裸片不同。
  • 焊接可靠性:遵循无铅回流曲线的推荐温度与时间,避免重复重熔引起性能退化。

六、替代与配套建议

在需要更低 DCR 或更高 Q、或更大电流能力时,可考虑同封装尺寸但不同材料或结构的贴片电感,或升至 0603/0805 等更大封装以获取更好电流与热性能。设计时也可配合旁路电容、阻尼电阻等元件共同实现所需频响与稳定性。

结语:MLK1005S8N2JT000 以其超小尺寸与 GHz 级自谐振频率适合多类高频与空间受限应用,选型时需综合考虑电流、DCR 与 Q 的权衡。如需在特定频段或功率条件下验证性能,建议进行实际装配测量或咨询技术支持获取更详细的评价数据。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.