Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK MHQ1005P1N0BTD25
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TDK MHQ1005P1N0BTD25
- Type
- TDK
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MHQ1005P1N0BTD25
- Electronic Component
- 1
- Package
- 0402
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.012g
- Inductor
- 1nH
- Electronic Component
- 1
- Electronic Component
- BM0262574038
- Electronic Component
- AEC-Q200
- Current
- 1.2A
- Frequency
- 15GHz
- Resistor(DCR)
- 10mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MHQ1005P1N0BTD25 产品概述
一、产品简介
MHQ1005P1N0BTD25 为 TDK 叠层贴片电感，感值 1 nH，适配 0402（1005 公制）超小封装。产品面向高频及车规应用场景，兼顾极低直流电阻与较高额定电流，适用于对体积和性能有严格要求的移动通信、汽车电子与射频前端电路。
二、电气性能要点
- 感值：1 nH，适合高频阻抗补偿与匹配。
- 额定电流：1.2 A，可承受中等电流负载。
- 直流电阻（DCR）：约 10 mΩ，功耗小，有利于降低温升。
- 自谐振频率（SRF）：约 15 GHz，工作频带延伸到毫米波段，有利于射频/微波应用。
三、可靠性与车规等级
本型号满足 AEC-Q200 车规等级要求，经过温度循环、机械振动、湿热等汽车级可靠性验证。适合车载信息娱乐、毫米波雷达、域控制器等需长期可靠运行的环境。
四、封装与焊接
封装为 0402（1005）小型表贴，便于高密度 PCB 布局。可采用常规无铅回流焊工艺贴装，建议按照 TDK 官方焊接曲线与 PCB 焊盘推荐尺寸执行，以确保焊点可靠性与电气特性稳定。
五、典型应用
- 射频匹配网络、滤波器、阻抗补偿
- 高频去耦、瞬态噪声抑制
- 汽车毫米波雷达与车载通信链路
- 高速接口（SERDES）及微波器件的寄生隔离
六、设计注意事项
叠层电感在高频下表现良好，但感值会随直流偏置与温度有变化，实际设计应参考元件的频率特性曲线与电流依赖曲线；布线时应将电感置于信号源或滤波节点附近，缩短引线长度以减少寄生电容与感抗；复杂射频匹配建议在样片上做 S 参数测量并优化布局。
如需进一步资料（完整规格书、频率响应曲线、封装尺寸与焊盘建议、可靠性报告），建议向 TDK 或授权代理商索取 MHQ1005P1N0BTD25 的官方 Datasheet。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
