Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK VLS3015CX-100M-H VLS3015CX
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK VLS3015CX-100M-H
- Type
- SMD, 3X3MM
- Unit
- Electronic Component
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- VLS3015CX-100M-H
- Electronic Component
- 1
- Package
- SMD,3x3mm
- Electronic Component
- Power Inductor
- Electronic Component
- ±20%
- Electronic Component
- 0.07g
- Inductor
- 10uH
- Electronic Component
- 1
- Electronic Component
- BM0257285075
- Electronic Component
- AEC-Q200
- Current
- 900mA
- Resistor(DCR)
- 286mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
VLS3015CX-100M-H 产品概述
一、产品简介
VLS3015CX-100M-H 是 TDK 推出的车规级功率电感，标称感值 10 μH，公差 ±20%，封装为 SMD（3×3 mm），专为空间受限的电源和信号滤波场合设计。器件通过 AEC‑Q200 认证，适合汽车和高可靠性电子设备使用。其直流电阻（DCR）较低为 286 mΩ，直流饱和电流 Isat 为 670 mA（在此电流下感值下降到规定百分比），在 低功耗开关电源与后级滤波中具有良好表现。
二、主要性能参数
- 感值：10 μH
- 精度：±20%
- 饱和电流（Isat）：670 mA
- 直流电阻（DCR）：286 mΩ
- 封装：SMD，3×3 mm
- 车规等级：AEC‑Q200（适用于汽车电子可靠性要求）
三、设计应用与性能注意点
- 典型应用：降压型 DC‑DC 转换器的输出滤波、功率轨去耦、EMI 抑制、车载电子电源模块等。
- 功率损耗估算：功率损耗主要由 I^2·DCR 决定。例如若电感工作电流为 0.5 A，则损耗约为 0.5^2×0.286 ≈ 0.0715 W，直流压降约 0.143 V。该数值用于热设计与效率估算。
- 饱和与去值考虑：Isat 为磁芯开始显著饱和的参考值。建议典型工作电流显著低于 Isat（设计上可考虑取 Isat 的 50% 左右或依据系统容忍度决定），以保证在工作工况下感值稳定并降低纹波电流导致的非线性失真。
- 频率特性：作为功率电感，关注纹波电流频率下的有效电感与损耗；具体频率响应与自谐频率请参照 TDK 原始数据表进行详细验证。
四、封装、布板与可靠性建议
- 布局：靠近开关器件或输出端放置，尽量缩短与 MOSFET/电容的连线，使用足够宽的铜箔并增加过孔导热（必要时使用热通孔）以降低温升。
- 焊接：按厂家推荐的回流曲线进行焊接，避免过热或过长热承受时间，以维护磁芯与引脚完整性。
- 可靠性：通过 AEC‑Q200 认证，适合车规级温度与振动要求，但建议在高温/高电流场景下进行系统级热循环测试与老化验证。
五、选型建议与替代策略
在选择时需综合考虑感值、DCR、饱和电流与封装尺寸：若系统对效率与压降敏感，可选择 DCR 更低或体积更大的系列；若需要更高的饱和电流或更窄的公差，应查找同系列或同厂其它型号（例如更大尺寸或不同磁芯材料的型号）。最终选型建议基于实际纹波电流、工作温度与目标效率进行仿真与样机验证。
六、总结
VLS3015CX-100M-H 以其 10 μH 的感值、车规认证与小型 SMD 封装，适合汽车电子及空间受限的电源滤波应用。设计时应关注 DCR 导致的功耗、工作电流相对于 Isat 的余量，以及合理的 PCB 布局与热管理，以保证长期稳定可靠的性能表现。若需更详细的频率特性、温升曲线或典型应用电路，建议参阅 TDK 正式数据手册并做样机验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
