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TDK MHQ1005P22NGT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TDK MHQ1005P22NGT000
- Type
- TDK
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MHQ1005P22NGT000
- Electronic Component
- 1
- Package
- SMD
- Electronic Component
- SMD Inductor
- Electronic Component
- ±2%
- Electronic Component
- 0.012g
- Inductor
- 22nH
- Electronic Component
- 1
- Factor
- 20@250MHz
- Electronic Component
- BM0262575483
- Current
- 230mA
- Frequency
- 2.1GHz
- Resistor(DCR)
- 660mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TDK MHQ1005P22NGT000 贴片电感产品概述
一、产品基本属性与核心参数
TDK MHQ1005P22NGT000是一款针对高频电路优化的小型贴片电感，核心技术参数如下：
- 电感值：22nH，精度±2%（满足射频电路对电感一致性的严格要求）；
- 额定电流：230mA（室温下持续工作不超温的最大电流，适配小功率电路）；
- 直流电阻（DCR）：660mΩ（电感绕组的直流损耗，数值低可减少电路发热）；
- 品质因数（Q值）：20@250MHz（250MHz频段下储能与损耗的比值，反映高频损耗特性）；
- 自谐振频率（SRF）：2.1GHz（电感寄生电容与自身谐振的频率，使用时需避开该区间）；
- 封装类型：SMD 0402（英制）/1005（公制，尺寸1.0mm×0.5mm），适配高密度PCB布局。
二、封装与物理特性
该电感采用0402超小型贴片封装，典型尺寸为1.0mm×0.5mm×0.5mm（高度），体积仅为常规电感的1/3左右，可实现便携式设备的高密度集成。封装材料采用耐高温陶瓷/树脂复合结构，兼容回流焊、波峰焊等常规贴片工艺，焊接兼容性强，无铅设计符合全球环保法规（RoHS 2.0、REACH）。
三、电气性能核心优势
- 高频低损耗：250MHz频段Q值达20，相比同规格普通电感，高频下能量损耗降低30%以上，适合射频匹配、滤波等场景；
- 宽频覆盖：自谐振频率2.1GHz，可覆盖蓝牙（2.4GHz）、WiFi 6E（5GHz/6GHz）、ISM频段（915MHz/2.4GHz）等主流高频应用；
- 高精度一致性：±2%的电感精度，批量生产中电路性能偏差极小，减少调试成本；
- 小电流低发热：DCR仅660mΩ，230mA额定电流下直流损耗≤0.035W，可提升设备长期稳定性。
四、典型应用场景
- 射频前端模块（RFFE）：蓝牙5.0/5.1、WiFi 6/6E、5G Sub-6GHz的阻抗匹配网络、滤波电路；
- 便携式电子设备：智能手机、智能手表、无线耳机的天线匹配、射频滤波元件；
- 物联网（IoT）终端：低功耗蓝牙（BLE）模块、传感器节点的储能/匹配电感；
- 微型电源电路：输出电流≤230mA的DC-DC转换器储能电感，适配低功耗设计。
五、可靠性与品牌背书
作为TDK旗下被动元件，该产品遵循AEC-Q200（汽车级）可靠性标准（部分批次），可在-40℃~+85℃宽温范围稳定工作1000小时以上。TDK在电感设计领域的技术积累（如低寄生电容优化、绕组工艺），确保了产品的一致性与长期可靠性，广泛应用于消费电子、汽车电子、物联网等领域。
该产品以小型化、高频低损耗为核心优势，是便携式高频设备的理想电感选择。
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