Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK C1005NP01H221JT000F
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TDK C1005NP01H221JT000F
- Type
- TDK
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- C1005NP01H221JT000F
- Electronic Component
- 1
- Electronic Component
- 220pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0258885424
- Electronic Component
- NP0
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C1005NP01H221JT000F 产品概述
一、产品概述
C1005NP01H221JT000F 为 TDK 出品的贴片多层陶瓷电容（MLCC），规格为 0402（公制 1005）封装，标称容量 220pF，公差 ±5%（J），额定电压 50V，温度特性为 NP0（也称 C0G）。该系列属于 I 类介质，具有极佳的温度稳定性与低损耗特性，适合对容量稳定性和高频性能有较高要求的电路设计。
二、主要特性
- 稳定性高：NP0 温度特性保证在工作温度范围内容量几乎不变，适用于精密滤波、谐振与频率确定电路。
- 低损耗：介质损耗小、等效串联电阻（ESR）和等效串联电感（ESL）较低，利于高 Q 值与射频性能。
- 小型化：0402 封装适合高密度贴片布板，有利于移动设备和微型模块的尺寸优化。
- 工艺兼容：适用于常见的贴片工艺与回流焊流程，便于自动化生产。
三、典型应用
- 高频旁路与去耦（尤其在 GHz 级应用中需考虑分布效应）
- 射频匹配网络、滤波器与谐振电路
- 时钟、振荡器与定时电路的频率确定元件
- 精密模拟电路的耦合/旁路与采样保持电容
- 通信设备、消费电子、测量仪器等对温漂敏感的场合
四、封装与布局建议
- 0402 封装尺寸小，建议采用贴片元件专用焊盘，保证焊盘尺寸与锡量匹配以降低热应力。
- 在可能的情况下避免将器件置于 PCB 边缘或受机械应力较大的位置，以降低断裂风险。
- 高频应用时应尽量缩短走线长度并在近端布置，以降低寄生电感与阻抗不连续。
五、选型与注意事项
- 虽然 NP0 对温度稳定性优异，但在极高电场（接近额定电压）下仍会出现微小 DC 偏置效应，设计时需留有容差。
- 小尺寸封装的额定电压与能量吸收能力有限，避免在大冲击电流或晶体管开关尖峰下直接承受脉冲。
- 若需更高容量或更低频率补偿，可并联多只不同封装或不同容量的电容以优化频率响应。
六、可靠性与工艺建议
- 推荐遵循制造商的回流焊曲线与湿热、温度循环等可靠性规范；常见无铅回流峰值温度在行业范畴内为参考值。
- 储存与贴装时防潮包装有助于提高焊接可靠性；取放与回流过程中注意避免机械冲击。
总结：C1005NP01H221JT000F 以其 220pF/50V/NP0 的组合，在需要温度稳定与低损耗的小型化应用中表现突出，是射频、定时及精密模拟电路中常用的高性能 MLCC 选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
