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TDK MHQ1005P10NGT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MHQ1005P10NGT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MHQ1005P10NGT000
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Inductor
- Electronic Component
- ±2%
- Electronic Component
- 0.012g
- Inductor
- 10nH
- Electronic Component
- 1
- Factor
- 23@250MHz
- Electronic Component
- BM0248691006
- Current
- 500mA
- Frequency
- 3.3GHz
- Resistor(DCR)
- 150mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MHQ1005P10NGT000产品概述
一、产品简介
MHQ1005P10NGT000为TDK公司0402封装高精度贴片电感，标称电感值10nH，公差±2%，直流电阻(DCR)约150mΩ，额定直流电流500mA。该器件在250MHz时品质因数Q=23，自谐振频率(SRF)约3.3GHz，适合高密度表面贴装电路中的射频与滤波应用。
二、主要性能参数
- 电感值：10nH，公差±2%（高精度，便于阻抗控制）
- 额定电流：500mA（需考虑电流热降和磁饱和）
- 直流电阻：150mΩ（低DCR，有利于降低损耗）
- Q值：23 @ 250MHz（中高Q，适用于射频回路）
- 自谐振频率：3.3GHz（高于常见工作频段，保证工作稳定）
- 封装：0402（1.0×0.5mm级别，适合高密度布局）
三、频率特性与设计说明
在低频区件呈感性阻抗，感抗随频率线性上升。示例：250MHz时感抗XL≈2π·250MHz·10nH≈15.7Ω，由Q=XL/Rac可估算交流等效损耗，Rac≈XL/Q≈0.68Ω（高于直流DCR，表明高频损耗受寄生与集肤效应影响）。当工作频率接近SRF(3.3GHz)时器件出现并联谐振，不再表现为纯感性，应避免在靠近SRF的频段作为单纯电感使用。
四、典型应用场景
- 无线射频匹配网络、谐振回路与负载隔离
- EMI/RFI抑制（高频共模/差模滤波）
- 偏置滤波（Bias-T）、射频前端滤波与阻断器
- 高密度消费电子、移动终端与射频模块
五、安装与使用建议
- 版图：尽量缩短与电感器件的连接走线，减小寄生电容与电感；贴片焊盘按0402标准设计并考虑阻焊孔与阻焊露铜尺寸。
- 焊接：兼容无铅回流工艺，建议遵循TDK或工厂提供的回流曲线，避免长时间高温。
- 热与电流管理：工作电流接近额定值时需关注自热与感值漂移，建议留有裕量并在高温条件下验证性能。
- 机械：0402体积很小，避免在贴装后施加强力弯折或压迫，防止焊点裂纹或器件破损。
六、选型注意事项
- 若需要更高电流或更低DCR，应选用更大封装或专用功率型电感。
- 在高频关键路径上，注意SRF与Q对回路响应的影响，必要时通过仿真验证实际频率特性。
- 对温漂、震动或高可靠性场景，建议查阅TDK完整规格书与可靠性试验数据以确认适配性。
总体而言，MHQ1005P10NGT000以其高精度、较高Q值和小体积，适合对尺寸与频率性能有严格要求的射频与滤波应用。若需更详细的频率特性曲线、温度系数或焊接曲线，请参考TDK官方规格书或联系供应商获取样片验证。
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