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TDK MLP2016V2R2MT0S1
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MLP2016V2R2MT0S1
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MLP2016V2R2MT0S1
- Electronic Component
- 1
- Package
- 0806
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- ±20%
- Electronic Component
- 0.028g
- Inductor
- 2.2uH
- Electronic Component
- 1
- Electronic Component
- BM0058427627
- Current
- 1A
- Resistor(DCR)
- 170mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MLP2016V2R2MT0S1 产品概述
一、产品简介
TDK MLP2016V2R2MT0S1 是一款叠层屏蔽功率电感，电感值为 2.2µH，公差 ±20%，额定电流 1A。器件采用 0806（2016 公制）低剖面封装，屏蔽式铁氧体材质与多层绕制结构相结合，适合空间受限的电源与滤波应用。型号以 T/R 卷盘方式供货，便于 SMT 贴装生产。
二、主要规格与特性
- 电感值：2.2 µH ±20%
- 额定电流：1.0 A（连续工作）
- 直流电阻（DCR）：典型 0.17 Ω，数据表中标示值可达 0.2125 Ω（请以具体批次数据为准）
- 主要工作频率：可用于约 2 MHz 范围的开关与滤波电路
- 封装尺寸：0806（2016 公制）— 适配常见贴片工艺
- 屏蔽结构：减小外泄磁场，降低相邻器件干扰
- 供货方式：T/R（Tape & Reel），便于自动化贴片
三、典型应用场景
- 占空比和开关频率在 MHz 级别的升降压（DC-DC）转换器的输入/输出滤波
- 电源去耦、EMI 滤波器与差模/共模噪声抑制
- 移动设备、物联网终端、车载电子（辅助电源）、消费电子的小功率电源模块
- PCB 空间有限且需屏蔽性能的电源架构
四、封装与物理特性
0806 小尺寸封装提供低剖面、高密度布局的优势。叠层构造使机械强度与电气一致性良好，屏蔽设计抑制外泄磁通，利于紧凑型多层板的器件并排布局。具体外形尺寸与焊盘建议请参考 TDK 官方封装图。
五、布局与使用建议
- 贴片放置时尽量靠近电源输入/输出端或开关管，减少走线电感与阻抗。
- 焊盘与地平面热量管理要均衡，避免 DCR 因过热上升或寿命降低。
- 对于高频开关应用，注意保持电感两端走线最短，减少寄生电容与辐射。
- 推荐按 TDK 数据手册给出的回流焊曲线进行焊接，避免超温导致材料性能退化。
六、可靠性与选型要点
- 额定电流 1A 为连续允许值，如工作点接近或超过该值，应考虑温升与磁饱和（可能导致电感下降），必要时选择电流裕量更大的型号。
- DCR 直接影响功率损耗与发热，选型时应结合应用的允许损耗评估。
- 工作频率接近或超出器件自谐频率（约 2 MHz）时，电感表现会出现显著变化，应验证实际电路中的增益、相位与滤波效果。
- 在关键应用建议索取并核对原厂完整数据手册与样品测试结果。
七、结论（选型建议）
MLP2016V2R2MT0S1 以其 2.2µH、电流 1A 与屏蔽叠层结构，适合小型电源滤波与中低功率开关电源场景。对体积、屏蔽和自动贴装有要求的项目具有较好适配性。最终选型请以实际工作电流、允许损耗与频率特性为准，并参考 TDK 官方数据手册与可靠性验证结果。
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