WMSIC Electronic Components

TDK C2012X7R1E475KT000N

ModelC2012X7R1E475KT000N
Package0805
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TDK C2012X7R1E475KT000N
Type
TDK
Unit
Electronic Component
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
C2012X7R1E475KT000N
Electronic Component
1
Electronic Component
4.7uF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.042g
Electronic Component
1
Electronic Component
BM0164083460
Electronic Component
X7R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:C2012X7R1E475KT000N

产品简介

C2012X7R1E475KT000N 是一款由著名电子元器件制造商 TDK 生产的多层陶瓷电容器(MLCC)。该电容器具有25V的额定电压、±10%的容差,容量为4.7μF,是在0805封装中提供的。因为其优越的性能参数和广泛的应用场景,该电容器在现代电子设备中得到了广泛的应用。

关键特性

  1. 电压和容量:

    • 额定电压为25V,适合在中低压应用中使用。
    • 容量为4.7μF,满足大多数电源旁路和耦合需求。
  2. 温度特性:

    • 采用X7R介质,保证在-55°C到+125°C的温度范围内具有相对稳定的电容量变化,适合各种环境条件下的稳定工作。
  3. 封装:

    • 采用0805封装(2.0mm x 1.25mm),小巧的尺寸使得该电容器非常适合于空间有限的电路设计,尤其是在移动设备和便携式电子产品中。
  4. 容差:

    • ±10%的容差使得C2012X7R1E475KT000N在电路设计时具备一定的灵活性,能够满足一般应用的精度要求。

应用领域

C2012X7R1E475KT000N电容器广泛应用于各种电子设备中,以下是一些典型的应用场景:

  1. 消费电子:

    • 在智能手机、平板电脑和其他便携式设备中,电容器被用来进行电源管理、去耦和信号处理。
  2. 计算机:

    • 用于主板、显卡及各类周边设备,主要用作滤波和平滑电源,提升系统的稳定性。
  3. 汽车电子:

    • 适用于汽车中各种电子控制单元(ECU),保证在恶劣环境下的正常工作。
  4. 工业设备:

    • 在工业自动化设备中,提供稳定的电源支持,增强设备的低噪声性能。

竞争优势

  • 稳定性和可靠性: X7R材料提供良好的温度特性,适应能力强,能够有效防止由于环境变化引起的电容值波动。
  • 体积小: 0805的封装体积小,使电路设计能够更加紧凑,能适应更小尺寸的PCB板设计。
  • 高品质: TDK作为全球领先的电子元器件制造商,提供高质量的产品,其声誉在业内享有盛誉。

结论

C2012X7R1E475KT000N是一款性能优异的贴片电容器,凭借其优良的电压、电容和温度特性,能够满足现代电子设备对高性能元器件的需求。无论是在消费电子、计算机、汽车电子还是工业设备中,均可以看到它的身影,体现出其广泛的应用潜力和出色的竞争优势。对于设计师和工程师而言,选择C2012X7R1E475KT000N将是实现电路设计目标的得力助手,是高可靠性和高性能电子元器件的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.