WMSIC Electronic Components

TDK MMZ1005D241CT000

ModelMMZ1005D241CT000
Package0402
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TDK MMZ1005D241CT000
Type
TDK
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
MMZ1005D241CT000
Electronic Component
1
Package
0402
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.012g
Electronic Component
1
Channel Count
1
Electronic Component
BM0254006323
Operating Temperature
55℃~+125℃
Current
200mA
@Frequency
240Ω@100MHz
Resistor(DCR)
900mΩ

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMZ1005D241CT000 产品概述

一、产品简介

MMZ1005D241CT000 为 TDK 品牌的高频磁珠(0402 封装),主要用于电路板上的电磁干扰(EMI)抑制与高频噪声衰减。典型指标为:阻抗 240Ω @ 100MHz,直流电阻(DCR)900mΩ,公差 ±25%,额定电流 200mA,单通道,工作温度范围 -55℃ 至 +125℃。体积小、适合贴片工艺,适用于空间与成本受限的移动设备与消费类电子产品。

二、关键电气特性说明

  • 阻抗:240Ω @ 100MHz 表示在该频率点具有显著的阻抗,对抑制 100MHz 附近的高频噪声效果良好。磁珠的阻抗随频率变化,通常在高频段表现为电阻性损耗,有利于将噪声能量耗散为热能。
  • 直流电阻(DCR):900mΩ,意味着对直流通流或低频信号产生较小的压降,但仍需注意在 200mA 电流下的功耗与发热。
  • 额定电流:200mA,是器件在不超过推荐温升下可靠工作的最大连续电流。若实际电流接近或超过该值,应选用更大电流等级的磁珠或并联/替代方案。
  • 温度与可靠性:工作温度 -55℃~+125℃,适应常见工业与消费环境,但在高温工况应考虑热降额。

三、应用建议与布局注意事项

  • 典型应用:射频/模拟前端、数字供电去耦、接口线(USB/摄像头/天线匹配)以及I/O信号线的共模/差模噪声抑制。
  • 布局要点:将磁珠放置于噪声源靠近之处(例如供电源端或高速信号线入口),靠近器件引脚以最大化滤波效果;避免与敏感模拟地面直接相连,必要时配合旁路电容形成低通滤波网络。
  • 热与电流管理:在接近额定电流条件下,评估功耗与铜箔散热,必要时选择更高电流规格或并联器件(并联时注意电流分配不均问题)。

四、选型与测试提示

  • 选型要点:确认目标噪声频谱与磁珠的标称阻抗频率匹配;确认直流压降与电流额定值满足电路要求;留意封装与回流工艺兼容性。
  • 测试方法:使用阻抗分析仪或网络分析仪在目标频率段测量实际阻抗曲线;在实际 PCB 上评估噪声抑制效果与温升。
  • 公差说明:给定的 ±25% 表示规格允许的偏差范围,具体项目(阻抗或DCR)的公差应以厂商数据手册为准,设计时留有裕量。

五、封装与生产注意

0402 超小封装适合大批量贴片加工,但对焊膏印刷、回流曲线和贴装精度要求较高。存储及贴装前避免潮湿吸湿,遵循制造商的焊接和回流建议以保证成品良率和可靠性。

总结:MMZ1005D241CT000 以其在 100MHz 附近的高阻抗和低 DCR 特性,适合用于对空间敏感且需中低电流噪声抑制的应用场景。设计时应兼顾电流能力、热管理与阻抗频率特性,必要时参考完整数据手册进行详细验证。

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