WMSIC Electronic Components

TDK MMZ1608Y102BTA00

ModelMMZ1608Y102BTA00
Package0603
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TDK MMZ1608Y102BTA00
Type
TDK
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
MMZ1608Y102BTA00
Electronic Component
1
Package
0603
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.033g
Electronic Component
1
Channel Count
1
Electronic Component
BM0227741273
Operating Temperature
55℃~+125℃
Current
400mA
@Frequency
1kΩ@100MHz
Resistor(DCR)
500mΩ

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMZ1608Y102BTA00 产品概述

一、概述

MMZ1608Y102BTA00 是 TDK 出品的一款表面贴装磁珠(磁性滤波元件),封装尺寸为 0603(1608 公制)。该器件在 100MHz 时提供 1kΩ 的阻抗,直流电阻(DCR)约 500mΩ,额定通过电流 400mA,阻抗公差 ±25%,工作温度范围为 -55℃ 至 +125℃。单通道结构,适用于对高频干扰抑制有要求的小体积电源和信号线滤波场合。

二、主要电气参数

  • 阻抗:1kΩ @ 100MHz(典型值)
  • 直流电阻(DCR):500mΩ(典型)
  • 额定电流:400mA(连续直流通过能力)
  • 阻值公差:±25%
  • 工作温度:-55℃ ~ +125℃
  • 通道数:1
  • 封装:0603(1608 公制) 这些参数决定了器件在中高频段抑制 EMI 能力与在通电时的压降和发热特性。

三、性能特点

  1. 高频抑制能力强:在 100MHz 附近提供较高阻抗,有效衰减开关电源和数字电路产生的射频噪声。
  2. 小尺寸:0603 封装便于高密度 PCB 设计,适合移动设备和便携电子产品。
  3. 低 DCR:典型 500mΩ 的直流电阻在保证滤波的同时,降低了压降和发热,有利于供电线应用。
  4. 宽温度范围:-55℃ 至 +125℃,适合工业级应用环境。
  5. 额定电流 400mA,适用于中低电流电源线和信号线滤波。

四、典型应用场景

  • 移动通信终端和无线模块的天线/射频前端滤波(需注意匹配)。
  • 电源线滤波(特别是分支或局部电源去耦)。
  • 数字电路高速信号线的共模/差模干扰抑制(单通道时常用于单线)。
  • 汽车电子、工业控制等对工作温度有较高要求的场景。

五、使用建议与布局注意事项

  1. 布局:尽量靠近干扰源或被干扰的器件放置,减小耦合回路面积。
  2. 串联应用:在电源线上串联使用可改善高频噪声抑制,必要时与旁路电容配合形成低阻带。
  3. 热管理:在接近额定电流工作时注意检查压降与功耗,必要时进行热仿真或测温评估。
  4. 焊接工艺:遵循 TDK 推荐的回流焊曲线,避免过长高温暴露以免影响性能。
  5. 失效模式:若超过额定电流或长期在高温高湿环境下工作,可能出现阻抗下降或直流电阻变化,应留有裕量。

六、替代与选型建议

选择时应关注工作频段的阻抗曲线、额定电流与 DCR 三项指标。若需要更高电流承载能力或更低 DCR,可考虑更大封装或不同型号磁珠;若需要更宽频带或更高阻抗,可选用复合结构或多级滤波方案。

七、采购信息

器件型号:MMZ1608Y102BTA00;品牌:TDK;封装:0603;关键参数:1kΩ@100MHz、DCR 500mΩ、额定电流 400mA、±25%。采购时注意确认批次、阻抗测试频率点及供应商原厂认证以保证一致性。

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