WMSIC Electronic Components

TDK MLG1005S82NJT000

ModelMLG1005S82NJT000
Package0402
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TDK MLG1005S82NJT000
Type
TDK
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
MLG1005S82NJT000
Electronic Component
1
Package
0402
Electronic Component
SMD Inductor
Electronic Component
±5%
Electronic Component
0.012g
Inductor
82nH
Electronic Component
1
Factor
8@100MHz
Electronic Component
BM0255086214
Current
200mA
Frequency
700MHz
Resistor(DCR)
1.01Ω

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MLG1005S82NJT000 — TDK 0402 82nH 贴片电感 产品概述

一、概述与主要参数

MLG1005S82NJT000 是 TDK 面向高频小信号应用的 0402(1.0 × 0.5 mm)贴片电感。主要电气参数:标称电感 82 nH,公差 ±5%,额定电流 200 mA,直流电阻(DCR)约 1.01 Ω,品质因数 Q = 8(100 MHz),自谐振频率(SRF)约 700 MHz。该器件采用多层陶瓷/磁性材料结构,适合占板面积和高度受限的微型射频与滤波电路。

二、特性与性能解读

  • 高频特征:Q 值在 100 MHz 附近表现中等(Q≈8),适用于中高频段的匹配网络与谐振回路;SRF ≈ 700 MHz 以上该器件开始表现为容性,应避免在自谐振点附近作为纯感性元件使用。
  • 电流与损耗:额定直流电流 200 mA,DCR 较高(1.01 Ω),表明该器件为小信号用途而非功率滤波或电源扼流。高 DCR 会在直流偏置或低频应用中产生较大损耗和热量。
  • 尺寸与封装:0402 小封装适合高密度贴装,但机械和热冲击敏感,需注意贴装工艺和回流曲线。

三、典型应用场景

  • 射频匹配网络、谐振回路与带通/带阻滤波器中的小电感元件。
  • 射频偏置支路/射频隔离中的阻塞电感(RF choke),尤其在频率显著低于 SRF 的工况下。
  • EMI 抑制与信号完整性改善,但限于低电流、低功率应用。
  • 手机、蓝牙、GPS、无线模块、射频前端及高频器件的紧凑型电路。

四、设计注意事项

  • 频率选择:在接近或超过 700 MHz 的设计中需谨慎,必要时根据实际电路测量器件的等效电抗曲线并仿真。
  • 电流与热:当电流接近或超过额定值时,会出现电感值下降与温升,需做电流裕量和热管理。
  • DCR 与损耗:若对损耗敏感(如低噪声放大、振荡器稳定性),应评估 DCR 对增益和相位的影响。
  • 封装应力:0402 尺寸对板面对齐、焊接温度和机械应力敏感,建议按照厂方推荐的回流曲线和焊盘设计。

五、封装、可靠性与生产建议

  • 常见供应形式为卷盘(tape-and-reel),便于贴片机直接装配。
  • 推荐遵循 TDK 的 PCB 推荐焊盘与回流焊工艺(避免超高峰值温度与过长保温时间),以降低开裂与连接不良风险。
  • 存储与处理时避免潮湿和机械碰撞,贴片在搬运与波峰/回流焊前若吸湿应按厂商规定回烘。

六、选型与替代方案建议

若设计要求更高电流容量、更低 DCR 或更高 Q,应考虑更大封装或专为功率/高 Q 优化的电感型号;若工作频率高于数百MHz,应选择 SRF 更高或专用射频电感。最终选型建议以实际电路测量与仿真为准,并参考 TDK 官方数据表获取完整电气与机械规范。

如需元件数据表、等效电路模型或在具体电路中的仿真支持,可进一步提供设计频率、工作电流与电路原理图,以便给出更精确的应用建议。

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