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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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CGA2B2C0G1H101JT0Y0F 是由知名电子元器件制造商 TDK 生产的一款贴片电容(MLCC),属于其高性能电容产品系列。以下是对此产品的详细介绍。
该电容的容值为 100 pF,精度为 ±5%。这意味着实际容值可能在 95 pF 到 105 pF 之间。这对于许多应用来说是足够精确的,尤其是在需要稳定且可靠的电容值的情况下。
CGA2B2C0G1H101JT0Y0F 使用 C0G 陶瓷介质。C0G 介质以其极低的温度系数(典型值为 0 ±30 ppm/°C)和高稳定性著称。这种材料使得电容在广泛的温度范围内保持稳定的性能,不会因温度变化而显著影响其容值。
此电容的额定电压为 50 V,这使得它适用于中等至高电压应用。这种额定电压水平足以满足许多电子设备的需求,包括但不限于功率供应、滤波电路和信号处理。
电容采用 0402 封装,这是一种常见的贴片封装尺寸。0402 封装的尺寸为 0.04 英寸 x 0.02 英寸(约 1.0 mm x 0.5 mm),非常适合现代电子设备中的空间有限场景。
由于 C0G 介质的低损耗和高稳定性,CGA2B2C0G1H101JT0Y0F 非常适合高频应用,如无线通信设备、射频滤波器和高频放大器。
在功率供应和滤波电路中,稳定的电容值和高额定电压使得此电容成为理想选择。它可以帮助去除噪音和纹波,确保输出电压的稳定性。
在汽车电子和工业控制领域,环境条件往往较为恶劣。C0G 介质的高温稳定性使得 CGA2B2C0G1H101JT0Y0F 能够在这些严苛环境中保持可靠的性能。
作为 TDK 的产品,CGA2B2C0G1H101JT0Y0F 符合严格的质量控制标准。TDK 是全球知名的电子元器件制造商,其产品以高可靠性、长寿命和卓越性能而闻名。
CGA2B2C0G1H101JT0Y0F 是一款高性能贴片电容,通过其优异的温度稳定性、精确的容值和高额定电压,满足了各种高要求应用的需求。无论是在消费电子、汽车电子还是工业控制领域,这款电容都能提供可靠和稳定的性能。对于需要高精度和高可靠性的设计工程师来说,这是一种理想的选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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