Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA2B2C0G1H470JT0Y0F 是由知名电子元器件制造商 TDK 生产的一款高性能贴片电容(MLCC),属于其广泛的多层陶瓷电容产品系列。以下是对此产品的详细概述。
CGA2B2C0G1H470JT0Y0F 由日本著名的电子元器件制造商 TDK 公司生产。TDK 以其高质量和可靠性的产品而闻名,广泛应用于各种电子设备和系统中。
此电容采用 0402 封装,这是一种常见的贴片封装形式,尺寸为 0.4 mm x 0.2 mm。这种小尺寸设计使其非常适合用于现代电子设备中的高密度布局。
CGA2B2C0G1H470JT0Y0F 使用 C0G 材质,这是一种高稳定性的陶瓷材料。C0G 材质以其极低的温度系数(典型值为 ±30 ppm/°C)而闻名,确保在广泛的温度范围内保持稳定的电容值。这使得它特别适合用于需要高精度和稳定性的应用场景,如滤波器、振荡器和时钟电路。
此电容的容值为 47 pF,精度为 ±5%。这种精度水平适用于大多数通用电子应用,包括信号处理、滤波和耦合电路。
CGA2B2C0G1H470JT0Y0F 的额定电压为 50 V,这意味着它可以在高压环境下运行,而不会出现电压崩溃或其他故障。这种高额定电压使其适用于需要处理较高电压信号的应用。
信号处理和滤波:
振荡器和时钟电路:
耦合和分压电路:
高频应用:
汽车和工业电子设备:
CGA2B2C0G1H470JT0Y0F 是一款高性能、可靠性的贴片电容,通过其优异的参数和特性,广泛应用于各种电子设备和系统中。其小尺寸、稳定性以及高额定电压,使其成为现代电子设计中的重要组成部分。对于需要高精度和稳定性的应用场景,这款电容是一个理想的选择。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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