WMSIC Electronic Components

TDK VLS201610HBX-100M-1 VLS201610HBX

ModelVLS201610HBX-100M-1
Package0806
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TDK VLS201610HBX-100M-1
Type
0806
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
VLS201610HBX-100M-1
Electronic Component
1
Package
0806
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.011g
Inductor
10uH
Electronic Component
1
Electronic Component
BM0255087603
Current
610mA
Resistor(DCR)
640mΩ
Electronic Component
Electronic Component
Electronic Component
2000
and Current(Isat)
610mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

VLS201610HBX-100M-1 产品概述

一、产品简介

VLS201610HBX-100M-1 是 TDK 出品的一款片式功率电感,标称电感值为 10 µH,公差 ±20%,额定电流 610 mA,饱和电流(Isat)同为 610 mA,直流电阻(DCR)约 640 mΩ,封装尺寸为 0806(公制 2016)。该器件面向小型电源滤波与能量储存应用,适用于空间受限且对中低电流有明确要求的电子产品。

二、主要电气参数

  • 电感值:10 µH,公差 ±20%
  • 额定电流:610 mA
  • 饱和电流(Isat):610 mA(定义为电感因直流偏置下降到额定值一定比例时的临界电流)
  • 直流电阻(DCR):≈ 640 mΩ
  • 封装:0806(外形小,适合片式贴装)

三、产品特点

  • 小尺寸封装,便于高密度 PCB 布局。
  • 适用于中低电流滤波与储能场合。
  • 直流电阻适中,便于在有限散热条件下实现稳定工作。
  • TDK 品牌与制造工艺保证批次一致性与可靠性。

四、典型应用

  • DC–DC 降压/升压变换器输入/输出滤波器。
  • 电源去耦与纹波抑制。
  • LED 驱动与便携式电源管理模块。
  • 一般电子设备的 EMI 抑制与电流限制场合。

五、封装与机械特性

0806 片式封装适合贴片回流焊工艺。器件尺寸小,需注意焊盘设计以保证可靠焊接与热传导。推荐按厂方数据手册的焊盘和回流曲线进行 PCB 布局与装配。

六、选型与使用建议

  • 由于 Isat 与额定电流相同,建议在实际应用中对电流进行适度降额(例如 60%–80%),以避免直流偏置导致电感值显著下降。
  • DCR 为 640 mΩ,在接近额定电流时会产生显著功耗(近似 P = I^2·DCR,610 mA 下约 0.24 W),应评估温升与热散逸。
  • 若应用对效率或温升敏感,考虑选用更低 DCR 或更高电流等级的型号。

七、可靠性与焊接注意

  • 遵循制造商推荐的回流焊曲线,避免过热或快速冷却导致机械应力。
  • 在 PCB 布局时为电感留出足够热扩散区域,并避免在高压差或高温区域紧邻敏感元件。
  • 进行电流冲击与温度循环测试以验证在目标环境下的长期可靠性。

八、采购与替代方案

  • 订购时请核对完整料号与包装卷装规格,并参考 TDK 数据手册获取详细电气特性曲线与环境规范。
  • 若需更高电流能力或更低 DCR,可在 TDK 产品线或其他厂商中选择更大封装或不同材料的功率电感作为替代。

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