Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
YFF31HC2A103MT000N 为 TDK 系列馈通电容滤波器,标称容值 10nF,公差 ±20%,额定电压 100V。器件采用 SMD-4P 封装,外形尺寸约 3.2 × 1.6 mm,设计用于在电源和信号引入点提供紧凑而高效的 EMI 抑制和去耦功能。
10nF ±20% 为常见中等容值,针对高频干扰有良好衰减效果;实际滤波效果还受频率、布局与负载条件影响。DCR 1.5 mΩ 说明导通路径电阻低,但器件的等效串联电阻(ESR)和等效串联电感(ESL)会随频率变化,实际设计应参考详细频率特性曲线与厂商数据表。
器件为 SMD 贴片件,建议采用标准回流焊工艺,注意焊接温度曲线与焊点湿润性以保证可靠性。PCB 布局时应尽量缩短电源线与接地回路,四端设计利于提高接地面完整性;对高电流路径注意铜箔宽度与过孔安排。若在高纹波电流或冲击电流场合使用,建议与供应商确认脉冲耐受与长期老化特性并考虑适当的电压降额。
在实际选型时,除本参数外请核对频率响应、ESR/ESL 曲线、耐振动与寿命测试数据。如需在汽车或医用等特定认证环境使用,请确认相应认证与可靠性测试结果。对系统 EMI 设计,常将此类馈通电容与共模/差模电感配合使用以获得最佳抑制效果。
如需更详细的电气特性曲线、封装引脚图或推荐的 PCB 布局范例,建议参考 TDK 官方数据手册或联系技术支持获取完整资料。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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