Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK MMZ1608A222BTD25
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MMZ1608A222BTD25
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MMZ1608A222BTD25
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- Ferrite Bead
- Electronic Component
- ±25%
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM0254006318
- Operating Temperature
- 55℃~+125℃
- Current
- 200mA
- @Frequency
- 2.2kΩ@100MHz
- Resistor(DCR)
- 800mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMZ1608A222BTD25 产品概述
一、概述
MMZ1608A222BTD25 是一款用于高频干扰抑制的表面贴装铁氧体磁珠（0603/1608公制），品牌：TDK。器件标称阻抗等级为 2.2kΩ（型号中的“222”表示），在射频范围对共模/差模高频干扰具有良好抑制效果。适用于电源线、信号线的射频噪声滤除与 EMI 降噪设计。
二、主要参数
- 阻抗（标称/典型）：2.2 kΩ（型号标称）；典型测量值 2.5 kΩ @ 100 MHz（±25%）。
- 误差：±25%（阻抗容差）。
- 直流电阻（DCR）：800 mΩ。
- 额定电流：200 mA（连续通过电流上限）。
- 通道数：1（单通道磁珠）。
- 工作温度：-55 ℃ ~ +125 ℃。
- 封装：0603（1608公制，适合高密度贴片工艺）。
三、结构与等效电路
磁珠本质为铁氧体体材料，通过在高频下表现为复阻抗（感性+损耗），等效上可视为频率相关的阻抗和串联电阻。低频时接近无感小阻抗，频率上升至数十MHz至数百MHz时阻抗迅速上升，吸收并衰减高频干扰能量。DCR 值会影响串联压降与功耗。
四、典型应用
- 电源与地线的 EMI 抑制（DC-DC 输出、线性稳压器旁路）。
- 高速数字信号线、射频前端的噪声过滤（在不影响直流供电的前提下抑制高频能量）。
- 智能终端、通信设备、汽车电子（符合-55~125 ℃ 工作环境）的 EMI 对策。
五、封装与安装建议
- 贴片封装为 0603，建议使用标准 0603 焊盘尺寸并遵循制造商推荐的焊膏量与回流曲线。
- 由于 DCR 较高（800 mΩ），在大电流场合需评估压降与发热：在额定 200 mA 下器件功耗约 32 mW，通常可接受，但近额定电流长期使用应留余量。
- 建议靠近噪声源或入/出口处布置，尽量减少与关键信号线的寄生耦合。
六、选型与注意事项
- 若需要更低直流压降或更高电流承载，应选择低 DCR 或更大封装（如 1210、1812）磁珠。
- 阻抗容差 ±25% 意味着批次间阻抗可能变化，关键 EMI 方案建议样件验证并在目标频段进行实际测量（使用 VNA 或 LCR 在 100 MHz 附近测试）。
- 关注回流焊温度与储存条件，避免潮湿敏感破坏；高温环境频繁热循环可能影响长期稳定性。
总体而言，MMZ1608A222BTD25 适合对 100 MHz 附近高频干扰有较高抑制需求且电流需求不大的应用场景，是在小尺寸封装下实现 EMI 抑制的常用元件。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
