WMSIC Electronic Components

TE Connectivity 5-1814832-2

Model5-1814832-2
PackageThrough-hole
BrandTE CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TE Connectivity 5-1814832-2
Type
TE CONNECTIVITY
Minimum package
350 卷

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TE CONNECTIVITY
Electronic Component
5-1814832-2
Electronic Component
1
Package
Through-hole
Electronic Component
Electronic Component
Electronic Component
RFCoaxial Connector
Electronic Component
2.19g
Electronic Component
50Ω
Frequency
6GHz
Electronic Component
1
Electronic Component
BM0265069813
RF
SMA
Operating Temperature
65℃~+165℃
Interface
6.35mm
Interface Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TE Connectivity 5-1814832-2 — SMA 直插板端母座产品概述

一、产品简介

TE Connectivity(泰科电子)型号 5-1814832-2 是一款面向印制电路板(PCB)的板端SMA射频连接器(母座),采用直脚(正脚)直插封装,单端口设计。该连接器延续并替代已停产型号 5-1814832-1,保持50Ω射频特性并支持高达6 GHz 的工作频率,适合对射频性能和机械牢固性有较高要求的板上射频接口场合。

二、主要特性

  • 接口类型:板端(PCB),内孔式(母座/受座)
  • 射频系列:SMA,特性阻抗:50 Ω
  • 端口数量:1(单通道)
  • 工作频率:直流至 6 GHz(典型应用频段内表现稳定)
  • 接触材料:铍铜(BeCu),提供良好的弹性和接触可靠性
  • 外形/安装:正脚直插(Through-hole / 插件),利于机械固定与焊接强度
  • 接口直径:6.35 mm(接口外/内结构尺寸特性)
  • 工作温度范围:-65 ℃ 至 +165 ℃,适应宽温环境
  • 封装形式:插件(Through-hole PCB mount)

三、典型应用场景

  • 无线通信设备(基站前端、收发模块)
  • 测试与测量仪器(频谱分析、信号源接口)
  • 射频放大器与滤波器模块的板级连接
  • 卫星、航空电子与国防通信系统(在满足环境与可靠性规范下)
  • 工业与医疗射频系统中板对板或板对外部电缆的接口解决方案

四、机械与电气性能要点

  • 电气:设计为50Ω特性阻抗,确保在0–6 GHz范围内低反射、低插入损耗的信号传输(具体插损/回波损耗性能请参考TE官方数据表或样品测试)。
  • 机械:直插式针脚提供稳固的板上固定,适配常规PCB厚度和通过孔安装工艺。铍铜触点保证长期接触弹性与可靠性。
  • 温度特性:工作温度覆盖典型的工业与军用范围,适合要求宽温稳定性的应用环境。

五、安装与焊接建议

  • PCB布局:为保证射频性能,应在连接器周边保留适当的接地平面,并对返回路径进行良好布局,避免在接口附近出现大片断裂的地层或不连续的接地。
  • 孔径与定位:直脚通过孔应按制造商推荐尺寸钻孔并适配通孔镀铜,保证焊锡填充与机械强度。
  • 焊接工艺:本组件支持手工焊与波峰/回流混合工艺,但具体焊接温度曲线与时间应参照TE的焊接指南以免影响绝缘体或金属表面处理。
  • 机械应力:避免在安装及后续使用中对接口施加过大横向力,必要时在外壳或支撑结构上提供额外受力支撑。

六、材料与环境可靠性

  • 触点材料为铍铜,常配合镀层(例如镀金/镀镍)以提高抗腐蚀性能与长寿命接触可靠性(具体镀层请以出厂信息为准)。
  • 工作温度与材料选型满足常见工业与部分军工级可靠性要求,但在特殊环境(如高盐雾、高腐蚀性气氛)下,应结合系统环境防护措施或选用额外防护件。

七、与停产型号的替代性

5-1814832-2 是指定用于替代已停产型号 5-1814832-1 的直接替换件,保持SMA母座的电气与机械接口匹配。替换时建议比对以下要点:接脚形状与针脚间距、PCB定位与固定孔位置、绝缘体外形尺寸及安装深度,以确保在PCB与外壳层面的直接替换无须二次改版。

八、采购与包装建议

  • 在批量采购前建议获取样品并在目标系统上进行插拔寿命、插入损耗与回波损耗等实际测试验证。
  • 采购时确认产品的完整型号与出厂材料/镀层信息,必要时索取制造商的认证与检验报告(RoHS、材料合规性等)。
  • 包装通常为防静电并提供机械保护,长途运输或仓储期间建议避免挤压与潮湿环境。

总结:TE Connectivity 5-1814832-2 为一款性能稳定、适配性强的SMA板端母座,适用于多种板级射频连接需求。为获得最佳系统性能,请结合TE官方数据表与具体PCB布局实践进行应用验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.