WMSIC Electronic Components

TAIYO YUDEN CBC2012T100M Inductor CBC2012T100M

ModelCBC2012T100M
Package0805
BrandTAIYO YUDEN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TAIYO YUDEN CBC2012T100M
Type
0805
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TAIYO YUDEN
Electronic Component
CBC2012T100M
Electronic Component
1
Package
0805
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.04g
Inductor
10uH
Electronic Component
1
Electronic Component
BM0263672699
Current
240mA
Resistor(DCR)
1.56Ω
Electronic Component
Electronic Component
Electronic Component
3000
and Current(Isat)
240mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TAIYO YUDEN CBC2012T100M 绕线电感器产品概述

一、产品核心参数明细

TAIYO YUDEN CBC2012T100M为一款无屏蔽绕线电感器,核心参数精准匹配低功耗电子设备需求:

  • 电感值:10μH,精度±20%,覆盖多数常规电路的电感量设计余量;
  • 电流规格:额定电流240mA(连续工作时电感温度上升≤标准值的最大电流),饱和电流Isat=240mA(电感值下降至初始值80%的临界电流),两者数值一致,保障额定工作状态下性能稳定;
  • 直流电阻(DCR):最大1.56Ω,低损耗设计减少功率浪费;
  • 封装尺寸:0805(英制)/2012(公制),尺寸为2.0mm×1.2mm,适配高密度PCB布局。

二、封装与结构设计特点

  1. 小型化封装优势
    0805封装占用PCB面积仅约2.4mm²,可显著降低终端设备体积,适配智能穿戴、物联网终端等微型设备的空间限制;
  2. 无屏蔽绕线结构
    采用高精度绕线工艺,线圈紧密绕制,结构紧凑;无屏蔽层设计降低制造成本,同时在中低频场景下满足EMI要求;
  3. 贴片引脚兼容性
    引脚适配回流焊、波峰焊等常规SMT工艺,批量生产良率高,适合大规模组装。

三、电气性能关键特性

  1. 精度与稳定性
    ±20%的电感精度无需额外补偿元件,简化电路设计;饱和电流与额定电流一致,避免工作电流下电感值骤降导致的性能波动;
  2. 低损耗特性
    1.56Ω的最大DCR在同规格绕线电感中表现突出:以240mA工作电流计算,直流损耗仅约0.09W,符合低功耗设备的能效要求;
  3. 频率响应范围
    绕线结构使其谐振频率适用于10MHz以下中低频电路,可覆盖电源滤波、射频辅助匹配等应用场景。

四、典型应用场景

  1. 便携式电子电源管理
    适配智能手环、蓝牙耳机的DC-DC升压/降压转换器,低电流规格提升电池续航;
  2. 电源滤波电路
    用于AC-DC适配器、移动电源的输出滤波,抑制纹波噪声,提升电源质量;
  3. 物联网终端模块
    低功耗传感器节点的信号滤波、电源稳压回路,匹配小型化设计需求;
  4. 消费电子辅助电路
    电视遥控器、智能音箱的射频匹配电路,辅助信号滤波与阻抗匹配。

五、品牌与可靠性保障

TAIYO YUDEN(太诱)拥有70余年被动元件研发经验,CBC2012T100M符合RoHS、REACH环保标准,部分批次通过AEC-Q200汽车级可靠性认证;成熟绕线工艺保障产品一致性,批量生产良率达99%以上,可满足工业级与消费级产品的长期稳定运行需求。

该产品凭借小型化、低损耗、高可靠性等特点,成为低功耗电子设备电感选型的高性价比方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.