Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
217EC0031是KNSCHA科尼盛针对低压高频紧凑电路设计的表面贴装(SMD)铝电解电容,核心聚焦「高纹波承载、低ESR、宽温可靠」三大特性,适配消费电子、工业控制等多领域的电源滤波、耦合需求。其470μF容值搭配10V额定电压,兼顾储能能力与低压系统兼容性,是替代传统插件电容、优化PCB布局的高性价比选择。
标称容值470μF,精度±20%,满足大多数电源滤波场景的储能需求——例如5V/3.3V系统的后端滤波,可有效抑制电压波动,避免电路误触发。
支持2.6A@100kHz的纹波电流承载,搭配32mΩ@100kHz的低等效串联电阻(ESR):在开关电源等高频环境中,低ESR可显著减少电容自身发热,提升系统效率,同时降低电磁干扰(EMI)。
10V额定电压适配低压电路(避免过压风险),**2000hrs@105℃**的工作寿命可覆盖长期高温场景(如工业烤箱、车载发动机舱周边)——假设每日工作8小时,实际寿命超1000天,满足设备长周期运行需求。
工作温度覆盖**-55℃至+105℃**,可应对极端低温(如北方户外设备)与高温场景,环境适应性远超普通民用级电容。
217EC0031采用SMD封装,具体尺寸为:
紧凑的尺寸设计使其能嵌入高密度PCB(如智能手机充电器、小型路由器),有效节省电路板空间;引脚采用标准化设计,兼容自动贴片机生产,焊接可靠性高,减少虚焊风险。
科尼盛对该产品完成多轮可靠性测试:
217EC0031凭借均衡的电气性能、紧凑尺寸与宽温可靠性,成为低压高频电路中铝电解电容的优选方案,可有效提升系统效率与稳定性,适配多领域量产需求。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products