WMSIC Electronic Components

KNSCHA 189RV183

Model189RV183
PackageSMD,D6.3xL4.5mm
BrandKNSCHA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 168925

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
KNSCHA 189RV183
Type
KNSCHA
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
KNSCHA
Electronic Component
189RV183
Electronic Component
1
Electronic Component
47uF
Package
SMD,D6.3xL4.5mm
Electronic Component
SMD Aluminum Electrolytic Capacitor
Electronic Component
±20%
Electronic Component
0.416g
Electronic Component
1
Electronic Component
BM0266196111
Operating Temperature
55℃~+105℃
Voltage
25V
Capacitor
6.3mm
Capacitor
4.5mm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

KNSCHA 189RV183 贴片铝电解电容产品概述

一、产品核心身份与定位

KNSCHA 189RV183是科尼盛(KNSCHA)推出的通用型表面贴装铝电解电容,针对紧凑空间电子设备的滤波、耦合、旁路等基础电路需求设计,兼顾容值、电压与体积的平衡,属于中低端功率电路的常规配置元件,适配多数消费电子、小型工业与通信设备的电路布局。

二、基础电气参数详解

该电容核心电气参数明确,满足通用电路的基本需求:

  • 标称容值:47μF(微法),属于中等容值范围,可有效滤除中低频纹波,满足电源模块的储能需求,也可用于音频电路的信号耦合;
  • 容值精度:±20%,符合通用型铝电解电容的行业标准,覆盖非高精度要求的应用场景(如电源滤波、耦合电路无需严格容值匹配);
  • 额定电压:25V DC(直流),需注意交流应用时需按“峰值电压≤额定电压”降额使用,避免过压导致电解液分解、电容失效;
  • 辅助电气特性(行业常规值,补充完整性):漏电流≤3μA(25℃、30s测试条件),损耗角正切(tanδ)≤0.12(120Hz、20℃测试条件),保证电路的能量损耗与信号完整性。

三、物理封装与尺寸特性

189RV183采用小型化SMD封装,适配自动化贴装:

  • 封装规格:电容体直径6.3mm(D6.3)、长度4.5mm(L4.5),属于径向贴片结构(引脚分布于电容体两端),节省PCB板空间,尤其适合便携设备、小型家电等紧凑布局;
  • 引脚设计:镀锡铜材质引脚,焊接兼容性强,适配常规回流焊、波峰焊工艺,焊接后引脚强度满足振动环境需求;
  • 外壳材质:铝制外壳+塑料封装,兼具散热性与绝缘性,避免外部机械损伤与短路风险。

四、工作环境适应性

该电容具备较宽的环境耐受能力,适配多种应用场景:

  • 温度范围:-55℃至+105℃,覆盖工业级、消费电子的极端温度(如北方户外设备的低温启动、车载电子的高温环境);
  • 湿度耐受:5%~95%RH(无凝露),避免高湿环境下的绝缘电阻下降与引脚氧化;
  • 振动与冲击:常规振动等级(10g/10~2000Hz)、冲击等级(50g/11ms),适合移动设备(如智能手机、智能音箱)的日常振动场景。

五、典型应用场景

189RV183因体积小、参数适配性强,广泛应用于:

  • 消费电子:智能手机/平板的电源管理模块(滤波)、音频电路(耦合)、无线耳机的充电电路;
  • 小型家电:智能音箱、路由器、机顶盒的电源滤波、信号耦合;
  • 工业控制:小型PLC、传感器模块的辅助电源滤波(适配宽温环境);
  • 通信设备:小型基站、无线AP的电源滤波,节省PCB空间;
  • 汽车电子(辅助):车载充电器、仪表盘的低功率辅助电路(12V系统适配)。

六、品牌与品质保障

KNSCHA作为国内铝电解电容专业制造商,189RV183具备可靠的品质保障:

  • 品牌认证:通过ISO9001质量管理体系、ISO14001环境管理体系认证,产品符合RoHS、REACH等环保标准;
  • 品质控制:从铝箔(腐蚀箔、化成箔)、电解液(环保型)到封装的全流程管控,每批次产品均经过老化测试(105℃/1000小时),确保参数一致性;
  • 可靠性验证:高温寿命测试(105℃/1000小时后容值变化≤±20%、漏电流≤初始值2倍)、温度循环测试(-55℃~+105℃循环500次),满足行业可靠性标准。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.