Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TE Connectivity 63824-5
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TE Connectivity 63824-5
- Type
- TE CONNECTIVITY
- Minimum package
- 8000 卷
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TE CONNECTIVITY
- Electronic Component
- 63824-5
- Electronic Component
- 1
- Electronic Component
- Solder Terminal Block
- Electronic Component
- 0.494g
- Electronic Component
- 1
- Electronic Component
- BM0264973759
- Electronic Component
- 6.35mm
- Electronic Component
- 1
- Electronic Component
- Electronic Component
- Electronic Component
- 2
- Electronic Component
- positions
- Electronic Component
- Electronic Component
- Electronic Component
- 8000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
63824-5 产品概述
一、概述
TE Connectivity（泰科电子）编号 63824-5 为 250 Tab 系列线对板连接端子，属于标准 0.250 英寸（6.35 mm）插片类型。该端子为单插片设计，带有两条焊脚以提高板上固定与焊接可靠性，并具备定位结构以便在 PCB 装配过程中精准就位。
二、主要参数
- 插片宽度：6.35 mm（0.250 英寸）
- 插片数量：1
- 焊脚数量：2（用于机械支撑与焊接）
- 附加特征：带定位（定位舌/柱）
- 本体镀层：锡（以改善可焊性与耐蚀性）
- 描述：线对板连接器 - 端子 250 Tab（适配常见的母端连接件）
三、材料与表面处理
端子材质通常采用导电性良好的铜合金基础，以保证电气导通与机械强度。表面采用锡镀层，优势在于良好的可焊性、适应波峰或手工焊接工艺，以及对环境中一般腐蚀的防护。具体基材与镀层厚度请以厂家数据表为准。
四、结构特点与优势
- 单插片设计满足常见的电源与信号连接需求；6.35 mm 为业界通用尺寸，兼容广泛的母端件。
- 双焊脚布局提高插头在 PCB 上的机械固定力，减少振动或插拔造成的松动风险。
- 定位结构便于自动贴装或人工插装时准确定位，提升装配效率并降低焊点缺陷。
- 锡镀层利于焊接工艺控制与长期接触可靠性。
五、典型应用
适用于家电、工业控制、电源模块、仪器仪表及交通电子等场景，作为板对线或板对线束的连接界面，常用于需频繁插拔或承载中等电流的连接点。
六、安装与焊接注意事项
- 在板上开孔与焊盘设计时，需考虑两焊脚间距及定位柱尺寸以确保卡位与焊接质量。
- 推荐根据生产工艺选择波峰焊或手焊，控制温度曲线以免损伤塑料部件（如有）。
- 焊接前后应避免强力弯折插片，安装完成后检查插片平整度与焊点润湿情况。
- 在有特殊环境（高温、高湿、强腐蚀）条件下，建议参考 TE 官方数据表确认耐候性与表面处理要求。
七、选型与采购建议
购买前核对配套母端尺寸、额定电流与电压要求、PCB 布局限制及环保合规（如需要 RoHS/REACH 证书）。如需批量装配或特定包装形式，可向供应商确认最小包装单位与可得性。为保证兼容性与长期可靠性，建议参考 TE Connectivity 的产品资料与机械图纸进行最终确认。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
