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TE Connectivity 166051-1
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TE Connectivity 166051-1
- Type
- TE CONNECTIVITY
- Minimum package
- 12500 卷
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TE CONNECTIVITY
- Electronic Component
- 166051-1
- Electronic Component
- 1
- Electronic Component
- Terminal Block
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0264888448
- AWG
- 20~24
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- 12500
- Electronic Component
- 0.2~0.56
- (OD)
- 1.27mm~1.52mm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
166051-1 产品概述
一、产品简介
166051-1 为 TE Connectivity（泰科电子）系列的插座触点，属于卡扣式、压接型信号触点，面向需要稳定电气连接和重复插拔可靠性的应用场景。触头以磷青铜为基材并镀金处理，适配线规 24–20 AWG（线径 0.2–0.56 mm²），可接受绝缘外径（OD）在 1.27–1.52 mm 范围内的电缆。
二、主要参数
- 导线适配：AWG 24～20（0.2～0.56 mm²）
- 绝缘外径（OD）：1.27 mm～1.52 mm
- 触头材质：磷青铜（Phosphor Bronze）
- 触头镀层：金（Au）
- 连接方式：压接（Crimp）
- 固定方式：卡扣式触点固定（latch retention）
- 用途属性：信号触点，20号规格（20 AWG 类别）
三、结构与材料优势
磷青铜材质提供良好的弹性和抗疲劳性能，保证触点在插拔过程中的弹簧力和接触压力；金镀层用于降低接触电阻并改善耐腐蚀性，特别适合低电流/低电压信号传输场合。卡扣式结构便于在母端壳体内实现正位固定，防止振动和拔出时接触失效。
四、安装与压接建议
为保证长期可靠性，建议使用与 TE 指定或等效的压接工具和模具进行端子压接，严格控制剥线长度与压接位置；压接后应进行拉力与电阻检查，避免过度压接或偏心造成金属疲劳或接触不良。一般不推荐对已压接的端子进行返工压接或焊接改动。
五、典型应用场景
适合电子通讯设备、工控模块、汽车电子（非高电流主回路）、仪器仪表及消费电子等需要可靠信号传输和重复插拔的应用。金镀触点尤其适用于对接触可靠性和抗氧化有较高要求的环境。
六、储存与运输注意
避免潮湿、腐蚀性气体和机械损伤；长期储存应采用防静电、密封包装并保持干燥。运输过程中防止挤压变形以免影响卡扣与压接端子的结构完整性。
七、选型与兼容性建议
在选型时，除确认线规与绝缘外径匹配外，还应核对与之配合的端子座/壳体型号是否为 TE 标准配套，以确保卡扣固定与接触配合良好。针对特殊环境（高温、盐雾、长寿命）可向供应商咨询更详细的金层厚度与循环寿命测试数据，以决定是否需要升级材质或表面处理。
如需进一步的电气/机械规格、耐久性数据或推荐的压接与测试工具型号，可提供具体应用场景以便给出更精确的技术建议。
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