Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TE Connectivity 61117-1
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TE Connectivity 61117-1
- Type
- TE CONNECTIVITY
- Minimum package
- 5000 卷
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TE CONNECTIVITY
- Electronic Component
- 61117-1
- Electronic Component
- 1
- Electronic Component
- Terminal Block
- Electronic Component
- 0.551g
- Electronic Component
- 1
- Electronic Component
- BM0264888445
- AWG
- 14~20
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Voltage
- 250V
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
- (OD)
- 3.3mm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
61117-1 产品概述
一、产品简介
61117-1 为 TE Connectivity（泰科）商用 MATE-N-LOK 系列的插座触头，属于电源用压接式触头。触头采用黄铜材质、镀锡处理，带锁定卡舌结构以确保在插拔时的可靠固定，适配 20–14 AWG（相当于 0.52–2.08 mm²）导线，允许绝缘外径（OD）最大 3.3 mm，额定电压 250 VAC。该件适合要求稳固接触与可重复插拔的电源连接场合。
二、主要技术参数
- 线规范围：AWG 14–20（0.52–2.08 mm²）
- 允许绝缘外径（OD）：≤ 3.3 mm
- 额定电压：250 VAC
- 触头材质：黄铜（铜合金）
- 触头镀层：锡（Sn）
- 连接方式：压接（crimp）
- 锁定方式：卡舌锁定，防松脱设计
- 系列匹配：MATE-N-LOK 商用电源连接器系列
三、材料与电气性能
黄铜基体提供良好的机械强度及导电性，锡镀层兼顾成本与可焊性，适合常规商用环境。锡层在抗氧化和接触电阻控制方面表现良好，但在高腐蚀性或高湿环境下不如金镀层稳定，选型时需综合考虑使用环境。
四、结构与安装
触头为压接端子，请使用与该截面相匹配的压接工具和模具，保证压接质量与接触可靠性。卡舌锁定结构可在插入对应插座壳体时实现正扣，防止振动或应力导致松脱。安装时注意剥线长度与导体整洁，避免裸线外露或绝缘进入压接区。
五、典型应用场景
适用于商用电源连接、工业设备配电、仪器仪表、电源模块及需要可插拔电源接头的场合，特别适合要求标准化 MATE-N-LOK 接插件体系的系统设计。
六、使用与维护建议
- 使用与线规匹配的压接钳与模具，进行拉力与电阻检测。
- 避免长期在强腐蚀性或高湿环境中使用；需时可选用更高防护等级或金镀触头。
- 插拔次数频繁的场合定期检查触头磨损与接触电阻，必要时更换。
- 存储时防潮、防尘，避免机械变形。
七、小结
61117-1 为一款面向商用电源连接的 MATE-N-LOK 插座触头，具备良好机械锁定与压接性能，适配 14–20 AWG 导线并满足 250 VAC 额定电压要求。选型时应结合使用环境、可靠性需求及配套壳体规格，采用合适的压接与检测流程以确保长期稳定运行。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
