Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TE Connectivity 917683-1
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- TE Connectivity 917683-1
- Type
- TE CONNECTIVITY
- Minimum package
- 8000 卷
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TE CONNECTIVITY
- Electronic Component
- 917683-1
- Electronic Component
- 1
- Electronic Component
- Terminal Block
- Electronic Component
- 0.1g
- Electronic Component
- 1
- Electronic Component
- BM0264973752
- AWG
- 20~22
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Voltage
- 250V
- Electronic Component
- Electronic Component
- Electronic Component
- 8000
- (OD)
- 1.4mm~1.8mm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
917683-1 产品概述
一、产品简介
917683-1 是 TE Connectivity（泰科电子）系列中的插座触点（receptacle contact），为标准 AMP Signal 双锁接插件体系设计的单根导线触点。该触点面向信号连接应用，采用锁定弹片方式固定于塑料插座内，提供可靠的机械卡扣与电气接触。
二、主要参数
- 线规（AWG）：20 ~ 22
- 允许绝缘外径（OD）：1.4 mm ~ 1.8 mm
- 适用导线截面积：0.3 ~ 0.53 mm²
- 触头材质：磷青铜（Phosphor Bronze）
- 触头镀层：镀锡（Sn）
- 额定电压：250 V（AC / DC）
- 固定方式：锁定弹片触点固定（locking tang）
- 导线方式：单根导线、压接（crimp）端子，兼容 AMP Signal 双锁结构
三、结构与材料特点
触头主体采用磷青铜材料，兼顾良好的导电性与机械弹性；表面镀锡既可降低接触电阻，又能提高抗氧化能力，便于成本敏感型信号连接应用。锁定弹片设计使触点插入兼容的塑料插座时实现可靠扣合，防止振动或拔出导致接触失效。
四、适用线缆与终端形式
该触点适配 AWG20–22 的单股或多股细导线，绝缘外径控制在 1.4–1.8 mm 范围内可保证压接质量与绝缘密封性。典型安装为压接终端（使用专用压接工具），压接后将触点插入 AMP Signal 系列双锁插头/插座中完成组装，双锁结构提供次级固定以增强连接可靠性。
五、安装、配套与注意事项
- 建议使用 TE 指定或等效的压接钳与模具，保证压接区形状与强度符合要求；
- 压接后应检查导线与触头的机械拉力、绝缘位置以及锁定弹片的咬合情况；
- 镀锡表面对焊接敏感，通常建议采用压接而非焊接工艺以免破坏镀层；
- 在高湿或腐蚀性环境下，应评估是否需要更高等级的防腐镀层或密封方案；
- 组装时匹配正确的 AMP/TE Housing 型号及双锁件，确保定位与二次锁定功能正常。
六、典型应用场景与优势
适用于仪器仪表、工业控制、消费电子与通信设备等需要可靠信号连接的场合。其优势在于：结构简单、成本效益高、安装便捷且与 TE AMP Signal 双锁体系高度兼容，能够在振动或间歇插拔环境中保持稳定电气性能。
备注：文中所列为依据已给出基础参数的产品概述。实际项目选型时，建议参考 TE Connectivity 的详细规格书（Datasheet）与额定电流/环境温度数据，或联系厂家确认包装与认证信息，以满足具体应用的电气与机械要求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
