WMSIC Electronic Components

TE Connectivity 1909763-1

Model1909763-1
PackageSMD
BrandTE CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TE Connectivity 1909763-1
Type
TE CONNECTIVITY
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TE CONNECTIVITY
Electronic Component
1909763-1
Electronic Component
1
Package
SMD
Electronic Component
RFCoaxial Connector
Electronic Component
0.101g
Electronic Component
50Ω
Frequency
6GHz
Electronic Component
1
Electronic Component
BM0264866335
RF
IPEX
Interface
2mm
Interface Type
Electronic Component
Electronic Component
1
Connector Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TE Connectivity 1909763-1 产品概述

一、产品简介

TE Connectivity 型号 1909763-1 为 UMCC(Micro-Coax Connectors)第一代板端插座,属 IPEX/UMCC 系列的 50Ω 推入式射频连接器。该件为单位端口(1 位)SMD(表面贴装)封装,适用于 PCB 板端与模块/线缆间的板对组件连接,频率覆盖至 6 GHz,旨在提供小体积、低剖面且性能稳定的射频连接解决方案。接口为内针(中心为母针/受体结构),接口直径约 2.0 mm,接口外露长度/高度约 1.25 mm,便于模块快速插拔与板上安装。

二、主要规格

  • 品牌:TE Connectivity(泰科电子)
  • 型号:1909763-1
  • 接口系列:UMCC / IPEX 系列(第一代)
  • 阻抗:50 Ω
  • 频率范围:直流至 6 GHz(典型射频工作上限)
  • 接口类型:内针(板端插座 / receptacle)
  • 端口数量:1 位
  • 接口直径:2.00 mm(中心接口尺寸参考)
  • 接口长度/高度:1.25 mm(插入/突出部分高度参考)
  • 安装方式:SMD(表面贴装,板载)
  • 应用类型:板对组件(Board-to-assembly / PCB to module)

三、结构特点与材料

1909763-1 采用紧凑的推入式结构设计,接口为受体形态以配合对应凸针或插头使用。外壳与接触件材质通常采用镀镍或镀金的铜合金,以保证良好的导电性、低接触电阻和耐磨性,同时抵抗焊接与环境腐蚀。SMD 底座设计便于回流焊工艺,实现与常规 SMT 生产流程的兼容。结构上兼顾机械强度与最小占板面积,适合空间受限的无线终端与模块化设备。

四、电气与射频性能

该 UMCC 插座以 50Ω 特性阻抗设计,保证在宽频段内的阻抗匹配,降低反射损耗。对于 0–6 GHz 的应用,插座能提供稳定的插入损耗与回波损耗表现(具体 V.S.W.R. / S 参数视配对线缆/插头及 PCB 走线设计而定)。在高速无线(如 Wi-Fi、BT、GPS、LTE IoT 等)及射频测试接口场景中,能保证信号完整性与较低的串扰风险。由于采用 SMD 形式,布局时应考虑阻抗控制(微带或带状线过渡)与接地回流路径,以维持设计的射频性能。

五、机械安装与注意事项

  • 装配方式:支持标准 SMT 回流焊流程;在设计 PCB 贴片与焊盘时,建议参考厂方推荐封装与焊盘图以保证焊点可靠性。
  • 插拔:为推入式连接,适配器插拔方便,但建议在反复插拔或有振动工况下评估耐久性与保持力。
  • 基板布局:为保持 50Ω 阻抗匹配,应根据 PCB 堆叠与介电层厚度选择合适的微带线或带状线参数;为减小接地回流路径,可在连接器附近设置充分的地铜与过孔。
  • 清洗与维护:回流焊后如需清洗,避免使用会腐蚀金属表面的试剂;安装与使用过程中避免异物进入插座口以免损伤内针。
  • 验证:批量应用前建议进行插拔寿命、振动/冲击与射频性能测试,确保与目标插头/线缆的匹配性能满足系统需求。

六、典型应用场景

  • 无线通信终端:Wi‑Fi、蓝牙、GPS、蜂窝 LTE/5G 前端模块的天线连接;
  • 物联网模组:小型化无线模组与主板的板对模块连接;
  • 消费电子:笔记本、平板、智能穿戴等对外天线接口;
  • 工业与车载短距离射频连接:对射频性能与体积有明确要求的嵌入式系统;
  • 原型与测试平台:作为板对模块/适配器快速连接的解决方案。

七、采购与选型建议

在选型与采购 1909763-1 时,建议确认:

  • 与之配套的插头/电缆端型号与机械/电气兼容性;
  • PCB 封装与回流焊工艺是否匹配(查看厂方推荐的 PCB 尺寸与焊盘信息);
  • 所用频段是否在 0–6 GHz 范围内,及目标系统对 S 参数的具体要求;
  • 若应用于振动或高可靠场景,需与供应商确认插拔寿命与机械保持力等可靠性测试数据。

总结:TE 1909763-1 为一款面向小型化射频应用的 UMCC 50Ω 板端 SMD 插座,适合对空间、射频性能和自动化装配有要求的消费电子与模块化无线系统。在实际设计中建议配合厂方资料完成 PCB 和匹配件的校核,以获得最佳的射频与机械性能。

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