WMSIC Electronic Components

TE Connectivity 1718760-1

Model1718760-1
BrandTE CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

16 specifications

Core information

Product name
TE Connectivity 1718760-1
Type
TE CONNECTIVITY
Minimum package
6000 卷

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TE CONNECTIVITY
Electronic Component
1718760-1
Electronic Component
1
Electronic Component
Terminal Block
Electronic Component
0.26g
Electronic Component
1
Electronic Component
BM0264973688
AWG
18~20
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
6000
(OD)
1.4mm~1.9mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TE Connectivity 1718760-1 插片式端子 产品概述

一、产品简介

1718760-1 为 TE Connectivity(泰科电子)推出的一款插片式端子,面向需要可靠线对板/线对线连接的低压电子和电气设备。端子采用插片(blade/tab)结构,适配 MCON 1.2mm 系列接口,具有密封选项与可靠的表面镀层,便于在潮湿或有污染的环境中使用。

二、主要规格(关键参数)

  • 线规(AWG):18 ~ 20
  • 允许绝缘外径(OD):1.4 mm ~ 1.9 mm
  • 适用导线截面积:0.5 ~ 0.75 mm²
  • 插片宽度:1.2 mm(0.047 in)
  • 插片厚度:0.6 mm(0.024 in)
  • 触头镀层:锡(Sn)
  • 接口家族/系列:MCON 1.2mm
  • 可选密封:支持(提高防潮防尘能力)

三、结构与材料说明

触头通常采用高导电性铜合金制造,以保证良好机械强度和低接触电阻;表面采用锡(Sn)镀层,兼顾成本、可焊性与防腐蚀性能。插片厚度 0.6 mm 及 1.2 mm 的插片宽度设计,兼顾插拔可靠性与空间节约。密封结构(若选配)可配合相应的密封垫或密封壳体,提升环境耐受性。

四、性能与适用场景

本端子面向低至中等功率传输场合,适用于家用电器、工业控制模块、通信设备、汽车内装低压线路及各类消费电子连接方案。锡镀层有利于焊接与长期导电稳定性;密封选项使其可用于有湿气或轻度污染的环境。

五、装配与使用建议

  • 推荐使用与端子匹配的压接工具和模具,确保压接质量并通过拉脱力检查;
  • 剥线长度与绝缘 OD 匹配,避免过度剥离或绝缘挤压导致接触不良;
  • 若采用密封端子,配合相应密封件安装,保证密封面清洁无毛刺;
  • 装配后建议进行通断及接触电阻检测,验证长期可靠性。

六、选型与注意事项

  • 确认线规与导线截面积在 1820 AWG / 0.50.75 mm² 范围内;
  • 根据目标环境决定是否使用密封型;高腐蚀环境可考虑额外防护或更高等级镀层;
  • 与 MCON 1.2mm 系列连接件配合选型,确保机械配合与电气兼容。

七、维护与储存

保持干燥、避免长期暴露在含硫或酸性气氛中;长期库存前可用防潮包装密封保存。装配现场应防止油污、焊渣进入接触面,影响接触电阻与可靠性。

总结:1718760-1 提供了紧凑的 1.2 mm 插片尺寸与可密封设计,适合对空间与环境有一定要求的线端连接方案,是在低压低中功率应用中追求成本与可靠性平衡时的常用选择。若需更详细的电气额定值或机械测试数据,建议参考 TE 官方数据手册或联系供应商获取完整规格书。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.