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TECH PUBLIC PESD3V3L1BA
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TECH PUBLIC PESD3V3L1BA
- Type
- TECH PUBLIC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TECH PUBLIC
- Electronic Component
- PESD3V3L1BA
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Electronic Component
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.053g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Cj- Capacitor
- 70pF
- Electronic Component
- BM0219861864
- Operating Temperature
- 55℃~+125℃
- Voltage
- 12V
- Electronic Component
- IEC 61000-4-2；IEC 61000-4-4；IEC 61000-4-5
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PESD3V3L1BA 产品概述
一、产品简介
PESD3V3L1BA 是一款双向静电放电（ESD）保护器件，专为保护敏感电子设备免受瞬态电压和静电放电的影响而设计。该器件由 TECH PUBLIC（台舟电子）制造，采用 SOD-323 封装，具备稳定的性能和高效的保护能力，是现代电子设备中不可或缺的保护元件。
二、产品特性
双向保护：PESD3V3L1BA 具有双向放电特性，可以有效地保护信号线及电源线在正负电压下的安全。这一点对于需要双向数据传输的设备尤为重要。
额定工作电压（Vrwm）：该器件的额定工作电压为3.3V，使其适用于大多数低电压应用，如智能手机、平板电脑和其他便携式电子产品。
静电放电（ESD）能力：PESD3V3L1BA 能够承受高达30KA的空气放电和接触放电，确保在操作过程中能够有效抵御来自环境或用户操作造成的静电损伤。
小型封装：采用 SOD-323 封装，具有体积小、易于集成的特点，适合空间有限的电路板设计。这个封装形式不仅提供了良好的热导性和电性能，还使得安装更加便利。
低漏电流：在正常工作状态下，PESD3V3L1BA 能够保持低漏电流，保证设备的能效与稳定性。
频宽特性：该器件在高频信号传播中表现良好，适合用于USB、HDMI等高速数据传输接口。
三、应用场景
PESD3V3L1BA 可广泛应用于以下领域：
移动设备：如智能手机、平板电脑、笔记本电脑等，PESD3V3L1BA 在这些设备内部提供了对重要数据线的保护，以确保设备在多变的环境中依然可靠工作。
消费电子：电视机、音响系统和家用电器等也可利用该元件来防止因静电放电而造成的损害。
工业设备：在各种自动化设备和传感器中，静电保护是必不可少的环节，PESD3V3L1BA 的高耐受性为这些设备提供了强有力的支持。
车载电子：现代汽车配备了大量的电子设备和系统，PESD3V3L1BA 可以有效地保护车载通信系统和控制单元，确保其在极端条件下的稳定性。
网络设备：如路由器、交换机和其他通信设备，PESD3V3L1BA 能够帮助防护这些设备的信号接口免受外部干扰及静电放电的伤害。
四、结论
PESD3V3L1BA 是一款表现卓越、性能可靠的双向静电放电保护器件。凭借其高等级的ESD保护能力、适中的工作电压和小型封装，它在众多电子应用中提供了无与伦比的安全保障。无论是在消费者电子、工业设备还是汽车电子等应用场景中，PESD3V3L1BA 都展现出了强大的保护效果，为设备的长期稳定运行奠定了基础，是现代电子产品中不可或缺的关键元器件。
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