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TECH PUBLIC TPNSR05F40NXT5G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TECH PUBLIC TPNSR05F40NXT5G
- Type
- TECH PUBLIC
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TECH PUBLIC
- Electronic Component
- TPNSR05F40NXT5G
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.011g
- Electronic Component
- 1
- Electronic Component
- BM0257250186
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 30uA@40V
- (Vf)
- 600mV@1A
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
- Voltage Rating(Vr)
- 40V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TPNSR05F40NXT5G 产品概述
一、器件简介
TPNSR05F40NXT5G 是 TECH PUBLIC（台舟电子）推出的一款小尺寸表面贴装整流二极管。器件主要参数：正向压降 Vf = 600 mV @ 1 A；直流反向耐压 Vr = 40 V；额定整流电流（持续）1 A；反向漏电流 Ir = 30 μA @ 40 V；非重复峰值浪涌电流 Ifsm = 400 mA。封装为 0402，适用于高密度贴装场合。
二、主要特性
- 低正向压降：600 mV @ 1 A，有利于降低功耗与发热。
- 中等耐压：40 V，适合 12 V 及以下电源轨的整流与保护应用。
- 低漏电：30 μA @ 40 V，在断态下保持较低泄漏电流，利于待机功耗控制。
- 小体积封装：0402，便于高密度 PCB 布局与微型化产品设计。
- 峰值冲击能力：Ifsm = 400 mA（非重复），适用于短时浪涌或启动脉冲，但不宜作为长期冲击承受方案。
三、典型应用
- 移动设备与便携终端的极性保护与整流
- 高密度开关电源的小信号整流与回收
- 信号链路防反接与二极管逻辑隔离
- IoT 终端、穿戴式设备、模块化子板的局部保护
四、封装与热管理建议
0402 封装热容有限，尽管器件额定整流电流为 1 A，但实际应用时需注意散热与拼板面积：
- 在焊盘处增加铜箔面积并靠近热敏元件布置散热槽或过孔；
- 必要时在器件两侧增加散热铜域或加大焊盘，提高导热；
- 对于长时大电流工况建议降额使用或并联多只器件分担电流；
- 浪涌电流 Ifsm 为 400 mA，仅用于短时脉冲，长期过载会损伤器件。
五、设计与可靠性建议
- 验证实际工作电流与环境温度，采用热仿真或实板测量 Vf 与温升；
- 反向漏电在高温下会上升，如对漏电敏感请留有裕量或选择更低 Ir 型号；
- 选型时注意回流焊温度曲线，遵循制造商的推荐焊接工艺以避免封装应力；
- 在需要更高浪涌抗性或更低 Vf 的场合，可考虑更大封装或肖特基系列替代。
六、采购与标识
器件标称为 TPNSR05F40NXT5G，品牌 TECH PUBLIC（台舟电子），封装 0402。常见为卷带（T&R）供货，订购时请确认包装单位、生产批次与质量合格证。
总结：TPNSR05F40NXT5G 在微型化产品中提供了较好的整流与保护能力，但 0402 的热限制与 Ifsm 的峰值特性决定其更适合用于小电流或短时脉冲场景。设计时需关注热管理与工作电流的降额安排。
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