WMSIC Electronic Components

TECH PUBLIC SMF05C

ModelSMF05C
PackageSOT-363
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC SMF05C
Type
TECH PUBLIC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
SMF05C
Electronic Component
1
Package
SOT-363
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.034g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
80pF
Electronic Component
BM0220136626
Operating Temperature
55℃~+125℃
Voltage
12V
Electronic Component
IEC 61000-4-2;IEC 61000-4-4;IEC 61000-4-5

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMF05C 产品概述

产品简介

SMF05C 是由 TECH PUBLIC(台舟电子)公司生产的一款小信号肖特基二极管,封装形式为 SOT-363。这种产品广泛应用于电子电路中,尤其在需要快速开关和低正向压降的场景中表现突出。SMF05C 型号的“5V”表示其反向耐压为 5V,适合用于各种低压电源管理和保护电路中。

封装特性

SMF05C 采用 SOT-363 封装,该封装形式具有体积小、引脚间距紧凑的特点,能够有效节省电路板空间。这种封装非常适合于高密度集成电路设计,以及要求小型化的移动设备和消费电子产品。

主要规格

  • 电流额定值:SMF05C 的最大正向电流(IF)通常为 500mA,适合用于低功率的电源管理应用。
  • 反向耐压:5V 的反向耐压(VR)使其在常见的电源电压条件下工作稳定,能够应对一定程度的瞬态电压。
  • 正向压降:相较于传统硅二极管,SMF05C 的正向压降较低,通常在 0.3V 左右,有助于降低功耗,提升电路效率。
  • 工作温度范围:可在广泛的温度范围(-55°C 至 +125°C)内稳定工作,能够适应多种应用环境。

应用领域

SMF05C 的低正向压降和快速开关特性使其在多个应用领域中得到广泛应用,具体包括但不限于:

  1. 电源管理:在开关电源和线性电源中用于整流,确保电源稳定供应。
  2. 反向保护:在电路中提供反向连接保护,防止设备因电源极性接反而损害。
  3. 信号整流:用于音频、视频及射频信号的整流和处理,保证信号质量。
  4. ESD 保护:在敏感器件输入端以较低的反向电压和快速恢复时间提供有效的静电放电保护。
  5. 便携式设备:由于其小巧的封装和低功耗特性,SOT-363 封装的 SMF05C 特别适合用于手机、平板以及其他便携式设备。

优势与竞争力

SMF05C 在市场上竞争力的优势体现在以下几个方面:

  • 高效能:与传统硅二极管相比,其低正向压降减少了能量损耗,在需要高效率的电源管理电路中尤为重要。
  • 小尺寸:SOT-363 的小封装设计非常适合当前电子设备越加小型化的趋势,尤其是在消费类电子产品中。
  • 耐用性:其宽广的工作温度范围和高耐压能力使其能够在各种严苛的工作环境中保持稳定性能。

结论

SMF05C 是一款性能优异、应用广泛的小信号肖特基二极管,适合于各类电路设计和应用。其低压降、高耐压、小封装等特性,使其成为电源管理、电路保护和信号整流中不可或缺的重要元件。随着电子技术的不断发展,对高效率、小型化元器件的需求持续增长,SMF05C 在未来市场中将展现出更大的潜力与价值。

对于设计工程师而言,选择 SMF05C 作为解决方案,将有助于提升产品的性能和可靠性,满足不断变化的市场需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.