WMSIC Electronic Components

TECH PUBLIC TPESD5311N

ModelTPESD5311N
PackageDFN1006-2
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC TPESD5311N
Type
TECH PUBLIC
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
TPESD5311N
Electronic Component
1
Package
DFN1006-2
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.01g
Electronic Component
1
Cj- Capacitor
0.18pF
Electronic Component
BM0247676956
Operating Temperature
55℃~+125℃
Voltage
12V;19V
Electronic Component
IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
200nA
Voltage(VBR)
7.5V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TPESD5311N 产品概述

一、产品简介

TPESD5311N 是 TECH PUBLIC(台舟电子)推出的一款用于静电(ESD)与浪涌(Surge)双重保护的瞬态电压抑制器(TVS)。器件针对低压高速信号线设计,具有低结电容、快速响应、较高脉冲吸收能力和宽工作温度范围,适用于便携电子、通信接口和工业控制等需要可靠防护的场景。封装采用 DFN1006-2,小型化,便于贴片工艺与板上布局优化。

二、主要技术参数

  • 反向截止电压 Vrwm:5 V(典型,用于 5V 供电/信号线保护)
  • 击穿电压 Vbr:7.5 V
  • 钳位电压(典型值):12 V;19 V(视具体测试条件/通道组合)
  • 峰值脉冲电流 Ipp:3 A @ 8/20 μs
  • 峰值脉冲功率 Ppp:60 W @ 8/20 μs
  • 反向漏电流 Ir:200 nA(常温典型)
  • 结电容 Cj:0.18 pF(极低,适合高速信号线)
  • 工作温度范围:-55 ℃ ~ +125 ℃
  • 防护等级与认证:符合 IEC 61000-4-5(浪涌)与 IEC 61000-4-2(静电放电)规范
  • 封装:DFN1006-2(超小型贴片)

三、器件特性与优势

  1. 低结电容(0.18 pF)——对高速数据线影响极小,适合 USB、SATA、PCIe、HDMI 等高速接口或差分信号线的保护。
  2. 低漏电流(200 nA)——在待机/低功耗系统中对电源与信号完整性影响最小。
  3. 较高的脉冲功率吸收能力(60 W @ 8/20 μs)和峰值电流(3 A)——可应对工业环境或户外设备遭受的瞬态浪涌与开关冲击。
  4. 宽温度范围与符合 IEC 标准的防护等级——适合车载、工业、消费电子等多种环境使用。
  5. 小型 DFN 封装——便于在空间受限的系统中近端放置于需保护的接口处,提高防护效率。

四、典型应用场景

  • USB/OTG/Type-C 接口过压与静电保护(尤其是 5V 供电与高频数据线)
  • 智能手机、平板、便携设备的射频/数据接口防护
  • 工业控制器与传感器接口(防止雷击浪涌与开关瞬变)
  • 通信终端及网络设备的信号线保护
  • 车载娱乐与信息系统的接口保护(符合较严格的温度与抗扰度要求)

五、封装与 PCB 布局建议

  • 将 TVS 器件尽可能靠近受保护端口或连接器放置,优先短距离连接到地线或参考平面,以缩短回路面积并降低感性耦合。
  • DFN1006-2 封装适合紧凑布局,但需保证焊盘与散热过孔(如有)设计合理,便于热量传导与冲击能量分散。
  • 对于差分高速线,若为双向保护,请参考差分对布局规则,确保对等长度与阻抗连续性。
  • 在可能的情况下,配合串联保护元件(如小阻值电阻或阻抗匹配器)以进一步减小浪涌能量传递到敏感器件上。

六、使用注意事项

  • 钳位电压受测试条件(脉冲电流大小、波形及测试环境)影响,设计时应以实际系统测试值为准,留有足够的裕量避免误触发或器件过载。
  • 对于高能量冲击或频繁大电流脉冲的应用,应评估器件的循环耐受能力,并在必要时采用多级防护或更高功率等级的 TVS。
  • 低结电容虽利于高速信号,但仍建议在最终系统中做信号完整性验证,确保插入损耗和反射在可接受范围内。

七、可靠性与认证

TPESD5311N 满足 IEC 61000-4-2 与 IEC 61000-4-5 的抗静电与浪涌测试要求,适合在有静电放电或电网浪涌风险的应用中使用。器件的宽温工作范围与低漏电流特性也保证了长时间运行的稳定性。

八、总结

TPESD5311N 是一款面向 5V 类供电与高速信号线的高性能 TVS/ESD 保护器件,具有低结电容、低漏电流、良好的脉冲能量吸收能力和小型 DFN 封装,适用于消费电子、通信设备与工业控制等需要既要高速传输又要高可靠性的场景。采用该器件时,建议结合 PCB 布局与信号完整性验证,确保在实际浪涌/静电事件中能提供可靠保护并最小化对信号的影响。

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