WMSIC Electronic Components

TECH PUBLIC AZ5325-01F AZ5325

ModelAZ5325-01F
PackageDFN1006-2
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC AZ5325-01F
Type
TECH PUBLIC
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
AZ5325-01F
Electronic Component
1
Package
DFN1006-2
Electronic Component
Electronic Component
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.009g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.6pF
Electronic Component
BM0226539321
Voltage
9V;15V
Electronic Component
IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
80nA
Voltage(VBR)
9V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AZ5325-01F 产品概述

一、简介

AZ5325-01F 是 TECH PUBLIC(台舟电子)推出的一款小尺寸单路双向 TVS/ESD 晶片,用于静电放电与浪涌保护。器件采用 DFN1006-2 微型封装,专为对空间、带宽和低漏电有高要求的便携、通信和工业电子接口设计,满足 IEC 61000-4-2(ESD)与 IEC 61000-4-5(浪涌)防护等级要求。

二、主要特性

  • 极性:双向,适合保护双向信号线或对称接口。
  • 通道数:单路(单条信号线保护)。
  • 反向截止电压 (Vrwm):5V,适配 5V 或以下工作电压系统(如 USB、GPIO 等)。
  • 击穿电压 (Vbr):约 9V。
  • 钳位电压 (Vc):在不同冲击条件下钳位电压为 9V(小冲击)至 15V(大浪涌),能在过压瞬态时有效限制电压峰值。
  • 结电容 (Cj):典型 0.6 pF,极低电容对高速差分或单端信号影响小。
  • 反向电流 (Ir):典型 80 nA,低漏电利于电池供电与低功耗系统。
  • 封装:DFN1006-2(小型、易于贴装,利于高密度布局)。

三、典型应用

  • USB/OTG、串行接口(UART、SPI、I2C)和 GPIO 线路保护。
  • 手机、平板、笔记本等便携设备的外部接口保护。
  • 工业控制与IoT终端的信号线静电及浪涌防护。
  • 摄像头、传感器线路与其他对电容敏感的高速接口。

四、主要电气参数(要点)

  • Vrwm:5V
  • Vbr(击穿):≈9V
  • Vc(钳位):约 9V(小冲击)至 15V(大浪涌,随冲击电流增大)
  • Cj:0.6 pF(典型)
  • Ir:80 nA(典型)
  • 标准兼容:IEC 61000-4-2 / IEC 61000-4-5

注:实际钳位电压受测试条件(如峰值冲击电流、波形)影响,选型时应参考完整的器件数据手册及典型测试曲线。

五、封装与安装建议

  • DFN1006-2 封装适合自动贴片生产,面积小、厚度低。
  • 布局建议:器件应尽量靠近被保护的连接器或引脚放置,外露焊盘朝向接地或信号返回路径,走线短且宽。对于外部接口,建议在 TVS 与接地之间使用至少一条接地过孔以降低回路电感。
  • 温升与焊接:小封装在大能量浪涌时有局部温升风险,若系统可能经历高能浪涌,应做热仿真或并联更大功率的浪涌保护元件。

六、选型与可靠性提示

  • 若主工作电压稳定在 5V 以下,AZ5325-01F 是良好选择;对更高工作电压需确认 Vrwm 与系统余量。
  • 关注钳位电压在最大浪涌条件下是否对后端电路安全;必要时与系列更高功率 TVS 或配合熔断/限流元件使用。
  • 在高速数据信号上使用时,0.6 pF 的低结电容可最大限度降低信号失真,但仍建议在样机阶段做信号完整性验证。

如需器件完整数据手册、典型波形或参考设计图,请告知使用场景与系统要求,我可以提供更具体的选型与布局建议。

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