WMSIC Electronic Components

TECH PUBLIC ESD7951ST5G

ModelESD7951ST5G
PackageSOD-923(0402)
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
TECH PUBLIC ESD7951ST5G
Type
TECH PUBLIC
Minimum package
8000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
ESD7951ST5G
Electronic Component
1
Package
SOD-923(0402)
Electronic Component
0.011g
Electronic Component
1
Electronic Component
BM0264717951
Electronic Component
Electronic Component
Electronic Component
8000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD7951ST5G 静电与浪涌保护器件产品概述

一、产品定位与核心价值

ESD7951ST5G是台舟电子(TECH PUBLIC)推出的单路TVS/ESD复合保护器件,专为电子设备中的静电放电(ESD)和瞬态浪涌干扰设计。其核心价值在于小封装下实现「高防护能力+低信号干扰」的平衡,可有效避免MCU、传感器、高速接口芯片等敏感元件因静电/浪涌冲击损坏,提升设备可靠性与使用寿命,适配从消费电子到工业场景的多类需求。

二、关键电气参数深度解析

该器件的参数针对典型应用场景优化,核心特性如下:

1. 防护能力参数

  • 反向截止电压(Vrwm):5V:适配主流5V供电系统,正常工作时呈高阻态,不影响电路功能;
  • 钳位电压:15V:瞬态过压时快速导通,将电压钳位在15V以内(远低于敏感元件击穿阈值),保护后端电路;
  • 峰值脉冲电流(Ipp):2A@8/20μs:符合IEC 61000-4-5浪涌测试波形,可承受2A峰值浪涌电流冲击;
  • 峰值脉冲功率(Ppp):30W@8/20μs:对应浪涌功率耐受能力,满足多数消费电子与工业设备的防护需求。

2. 直流特性参数

  • 击穿电压:7.5V:高于系统工作电压,确保正常状态下不导通,避免误触发;
  • 反向电流(Ir):80nA:极低漏电流,对系统功耗影响可忽略(尤其适合低功耗设备)。

3. 高频特性参数

  • 结电容(Cj):0.5pF:低结电容是核心优势——对1GHz以上高速信号(如USB 3.0、HDMI 2.0)传输损耗极小,不会导致信号反射或失真,完美适配高频接口防护。

三、封装与物理特性

ESD7951ST5G采用SOD-923封装(对应0402贴片尺寸),尺寸仅1.0mm×0.6mm×0.5mm(典型值),具备三大优势:

  • 小型化适配:适配高密度PCB布局,满足智能手机、智能手表等便携设备的空间限制;
  • 自动化兼容:表面贴装工艺支持高速自动化生产,降低制造成本;
  • 可靠性设计:引脚布局合理,焊接牢固,长期使用不易脱落,适配严苛环境。

四、可靠性与环境适应性

该器件的可靠性满足多场景需求:

  • 宽温工作范围:-55℃至+125℃,覆盖工业级与汽车级(部分场景)温度要求,可在极端环境下稳定运行;
  • 国际标准合规:通过IEC 61000-4-2(ESD)与IEC 61000-4-5(浪涌)测试,防护等级符合行业通用标准,确保设备在人体静电接触、电源浪涌等干扰下的安全性。

五、典型应用领域

结合参数特性,ESD7951ST5G适用于以下场景:

  1. 消费电子:智能手机、平板的USB/Type-C接口、触控屏、摄像头模组防护;
  2. 穿戴设备:智能手表、手环的传感器、蓝牙模块防护;
  3. 工业控制:PLC模块、传感器节点、通信接口的浪涌+静电双重防护;
  4. 汽车电子:车载信息娱乐系统、ADAS传感器的辅助防护(需结合系统验证)。

六、品牌与品质保障

台舟电子(TECH PUBLIC)作为专业元器件制造商,拥有完善的生产与测试体系:ESD7951ST5G经过温度循环、湿度老化、振动测试等多轮可靠性验证,产品一致性与长期稳定性可靠,可作为高性价比的防护方案替代进口同类器件。

该器件凭借「小封装、低电容、高防护」的综合优势,成为电子设备静电/浪涌防护的优选器件之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.