WMSIC Electronic Components

TECH PUBLIC TPNUP4202W1T2G

ModelTPNUP4202W1T2G
PackageSOT-363
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC TPNUP4202W1T2G
Type
TECH PUBLIC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
TPNUP4202W1T2G
Electronic Component
1
Package
SOT-363
Electronic Component
Electronic Component
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.022g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.6pF;0.3pF
Electronic Component
BM0257715137
Operating Temperature
55℃~+125℃
Voltage
13V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
100nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TPNUP4202W1T2G 产品概述

一、产品简介

TPNUP4202W1T2G 是 TECH PUBLIC(台舟电子)推出的一款四路单向瞬态抑制二极管(TVS/ESD)器件,封装为 SOT-363,专为高速数据线与电源线的静电放电(ESD)与浪涌(Surge)保护设计。器件集成度高、体积小、易于贴片,是消费电子、通信设备及工业接口保护的理想选择。

二、主要参数

  • 极性:单向
  • 反向工作电压 Vrwm:5 V
  • 击穿电压 Vbr:7.5 V(典型)
  • 钳位电压 Vc:13 V(Ipp 测试条件下)
  • 峰值脉冲电流 Ipp:6 A (@ 8/20 µs)
  • 反向漏电流 Ir:100 nA(常温)
  • 结电容 Cj:0.6 pF / 0.3 pF(典型,不同通道/测量条件)
  • 通道数:四路
  • 工作温度范围:-55 ℃ ~ +125 ℃
  • 防护等级:满足 IEC 61000-4-2、IEC 61000-4-4、IEC 61000-4-5 要求
  • 封装:SOT-363

三、关键特性与优势

  • 低结电容(典型 0.3–0.6 pF),对高速信号干扰小,适合 USB、数据线等高速接口;
  • 低漏电流(100 nA),对低功耗系统无显著影响;
  • 单向设计对 5 V 工作电压系统(如 USB2.0)提供稳定保护;
  • 四路集成,节省 PCB 面积及装配量,成本效益高;
  • 宽温度范围与对多项 IEC 测试的适配,适合消费与工业环境使用。

四、典型应用场景

  • USB(D+/D-)与其他 5 V 数据接口的 ESD/浪涌保护;
  • 智能手机、平板、笔记本外围接口保护;
  • 路由器、交换机、机顶盒等通信设备的 I/O 端口防护;
  • 工业控制模块与传感器接口的瞬态抑制;
  • 可穿戴与物联网终端的板级防护方案。

五、推荐使用与 PCB 布局建议

  • 将 TVS 器件靠近受保护的接口或连接器贴片放置,缩短受保护引脚到器件的走线长度;
  • 器件接地端应直接回流到系统地(GND)的大地平面,采用短而宽的回流路径;
  • 对高速信号线避免打穿地或走长弯曲线,必要时可与共模电感配合使用以提高抗干扰能力;
  • 注意焊接工艺控制,避免高温或过度机械应力影响器件可靠性。

六、封装与采购

  • 封装:SOT-363,小体积、易于自动贴片;
  • 型号:TPNUP4202W1T2G(品牌:TECH PUBLIC / 台舟电子)。
    如需样片、完整电气特性曲线或更严格的认证数据,建议联系供应商获取最新数据手册与可靠性测试报告。

本器件以其低电容、低漏电、四路集成与小型封装,在需要兼顾信号完整性与瞬态保护的场合具有明显优势。

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