WMSIC Electronic Components

TECH PUBLIC SD36C-01FTG SD36C

ModelSD36C-01FTG
PackageSOD-323
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC SD36C-01FTG
Type
TECH PUBLIC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
SD36C-01FTG
Electronic Component
1
Package
SOD-323
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.027g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
40pF
Electronic Component
BM0264777497
Operating Temperature
55℃~+125℃
Voltage
60V
Electronic Component
IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
100nA
Voltage(VBR)
40V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SD36C-01FTG 产品概述

一、产品简介

SD36C-01FTG 是台舟电子(TECH PUBLIC)推出的一款单路瞬态电压抑制器(TVS),封装为小体积的 SOD-323,专为需要瞬态过压与静电放电保护的敏感电路设计。器件在浪涌与静电事件下提供快速钳位,有效保护电源线、数据信号线及传输线路上的元件免受 ESD、CDE 和 EFT 等瞬态干扰。

二、主要技术参数

  • 反向截止电压 Vrwm:36 V
  • 击穿电压 VBR:40 V
  • 钳位电压(典型):60 V
  • 峰值脉冲电流 Ipp:5 A @ 8/20 µs
  • 峰值脉冲功率 Ppp:300 W @ 8/20 µs
  • 反向漏电流 Ir:100 nA(典型)
  • 结电容 Cj:40 pF
  • 通道数:单路
  • 工作温度范围:-55 ℃ ~ +125 ℃
  • 防护等级/符合标准:IEC 61000-4-5(浪涌)、IEC 61000-4-2(ESD)
  • 封装:SOD-323(表面贴装,小尺寸)

三、主要特性与优势

  • 小体积:SOD-323 封装占用 PCB 面积小,适合空间受限的移动设备和板级保护。
  • 快速响应:对 ESD 与脉冲浪涌具有快速钳位能力,能在瞬态事件中迅速将电压限制在安全范围内,保护下游元件。
  • 低漏电流:典型反向漏电仅 100 nA,可用于对电流敏感的模拟和低功耗电路。
  • 中等结电容:约 40 pF,适用于多数数据和控制信号线,但在超高速差分信号(如高频串行链路)应评估对信号完整性的影响。
  • 符合国际电磁兼容标准:满足 IEC 61000-4-2/4-5,便于通过系统级 EMC 设计验证。

四、典型应用场景

  • 计算机与外设(如打印机、键鼠接口)线路保护
  • 商用自动化设备与工业控制器输入/输出保护
  • 通信设备与网络终端的接口保护(以太网端口外侧需评估电容影响)
  • 医疗电子设备的信号/电源端子保护(遵循医疗设备的额外安全规范)
  • 便携式与消费电子产品中对电源和数据线的瞬变防护

五、实用设计与布局建议

  • 直接靠近被保护器件布置:TVS 与被保护端口之间的寄生电感越小,钳位效果越好,建议焊盘布局尽量靠近接口。
  • 考虑串联限流:在高能脉冲环境或系统级浪涌防护中,可配合阻容滤波或熔断元件限制流入能量,延长 TVS 寿命。
  • 高速信号应用评估:结电容 40 pF 在高速或差分信号上可能引入反射或带宽下降,必要时使用专用低电容 TVS 或在系统层面评估。
  • 热管理:SOD-323 为小封装,在重复或大能量冲击下要考虑散热与能量承受能力,必要时在系统中增加更高能量的浪涌保护器件作为一级保护。
  • 焊接兼容性:支持常规回流焊工艺,遵循推荐的焊接温度曲线以避免封装应力。

六、选型与可靠性说明

SD36C-01FTG 适合要求中等能量吸收(300 W @ 8/20 µs)、高抗ESD 能力、以及对漏电流和封装尺寸有严格要求的应用场合。选型时应关注系统可能遭受的最大浪涌能量、信号带宽要求以及是否需要多级保护策略。在长期可靠性方面,工作温度范围宽(-55 ℃ ~ +125 ℃)适应严苛环境;但在频繁高能量冲击场合,建议进行系统级寿命验证并考虑并联或级联更大能量的防护元件。

如需电气特性曲线、封装尺寸图或推荐的 PCB 布局示意图,我可提供更详细的支持资料与应用参考。

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