WMSIC Electronic Components

TECH PUBLIC AZ1143-04F AZ1143

ModelAZ1143-04F
PackageDFN2510-10
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC AZ1143-04F
Type
TECH PUBLIC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
AZ1143-04F
Electronic Component
1
Package
DFN2510-10
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.028g
Electronic Component
1
Cj- Capacitor
0.3pF
Electronic Component
BM0264783036
Operating Temperature
55℃~+125℃
Voltage
15V
Electronic Component
IEC 61000-4-5
Current(Ir)
60nA
Voltage(VBR)
3.6V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AZ1143-04F 产品概述

一、产品简介

AZ1143-04F 是一款为低压、高速数据线设计的四通道低容型静电放电(ESD)抑制器,由 TECH PUBLIC(台舟电子)生产,封装为 DFN2510-10。该器件专为保护对信号完整性和低电容要求极高的接口而优化,能够在不显著影响高速信号的前提下,提供有效的瞬态抑制保护。典型应用包括 USB 2.0、IEEE1394、HDMI、各类 GPIO 口及其他低电压高速差分或单端数据线。

二、主要电气参数

  • 反向截止电压(Vrwm):3.3 V(适合 3.3V 或更低电压的敏感信号线)
  • 击穿电压(VBR):3.6 V(显示器件在钳制前的雪崩起始点)
  • 钳位电压(Vclamp):15 V(在峰值脉冲条件下的最大钳位电压)
  • 峰值脉冲电流(Ipp):4 A @ 8/20 μs(抗浪涌能力,满足常见脉冲能量吸收需求)
  • 反向电流(Ir):60 nA(在 Vrwm 下的漏电流,保证低静态损耗)
  • 结电容(Cj):0.3 pF(极低的结电容,最大限度降低对高速信号的影响)
  • 工作温度范围:-55 ℃ ~ +125 ℃
  • 抗扰度标准:符合 IEC 61000-4-5(对浪涌脉冲的防护能力)

三、器件特点与优势

  • 低电容设计(0.3 pF):对 USB2.0、HDMI 等高带宽信号影响极小,保证高速信号链的时序与幅值完整性。
  • 针对 3.3V 系统优化:Vrwm=3.3V 与 VBR=3.6V 配合,使在正常工作时不触发保护,在异常过压时迅速进入导通。
  • 合理的钳位与浪涌能力:15V 的钳位电压与 4A@8/20μs 的冲击承受能力,兼顾保护力度与设备安全。
  • 低漏电流:60 nA 的反向电流适用于对待机电流敏感的便携式与低功耗系统。
  • 宽温工作范围与工业等级可靠性:适用于严苛环境与工业级产品线。

四、典型应用场景

  • USB 2.0 数据线(D+/D-)保护,靠近连接器端或 PCB 引出点布置以降低并联电感与走线长度。
  • HDMI 或其他低压视频/音频接口的输入/输出端口防护。
  • IEEE1394(FireWire)等高速串行接口的静电与浪涌防护。
  • 各类 GPIO、串行信号线或传感器接口,特别是当线路需要保持较低加载时。
  • 消费电子、移动设备、嵌入式系统、工业控制终端等需抗静电干扰的产品。

五、封装与布局建议

  • 封装:DFN2510-10,小型表贴封装,便于高密度 PCB 设计与自动化贴装。
  • 引脚功能:四通道布局,常见连接方式为四个信号引脚分别到芯片内部的瞬态二极管阵列,公共端接地(具体引脚定义请参见详细数据手册)。
  • 布局要点:抑制器应尽量靠近接口或易受静电冲击的 PCB 边缘放置;尽量缩短每个信号走线到器件之间的长度;公共地应采用低阻抗大面积回流层并尽量靠近抑制器的地引脚,减少寄生电感。
  • 焊接与工艺:适用于标准无铅回流焊工艺,推荐遵循封装制造商提供的回流曲线与焊盘设计指南。

六、设计注意事项

  • 信号完整性:尽管器件具备极低结电容,但在高速差分对上仍建议评估总的端到端插入损耗与反射,必要时调整匹配阻抗或在器件前加入微小的串联阻抗。
  • 保护策略:在某些高能量干扰场景下,可与多级保护(如大功率 TVS、阻尼元件)配合使用,以分散能量并降低单级器件应力。
  • 温度与功耗:在持续或重复冲击场景,应评估器件温升与周围温度对寿命的影响,确保工作环境在推荐温度范围内。
  • 兼容性:在选择替代器件或多厂商采购时,注意比较 Vrwm、Cj、Ipp 与钳位电压等参数,确保替代品不影响信号性能与保护级别。

七、订购信息与可靠性

  • 品牌:TECH PUBLIC(台舟电子)
  • 型号:AZ1143-04F
  • 封装:DFN2510-10
  • 适用于需要兼顾低容性与可靠过压保护的高速接口应用。
  • 建议在产品开发阶段,基于实际 PCB 板级测试(如 TDR、串扰与 ESD 放电测试)验证器件性能,以达到最佳的保护与信号性能平衡。

如需完整的引脚定义、典型特性曲线与 PCB 焊盘建议,请索取 TECH PUBLIC(台舟电子)提供的 AZ1143-04F 详细数据手册。

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