WMSIC Electronic Components

TECH PUBLIC SN74LVC1G00DBVR

ModelSN74LVC1G00DBVR
PackageSOT-23-5
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC SN74LVC1G00DBVR
Type
TECH PUBLIC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
SN74LVC1G00DBVR
Electronic Component
1
Package
SOT-23-5
Electronic Component
Logic Gate
Electronic Component
74LVC
Electronic Component
0.035g
Electronic Component
1
Channel Count
2
Features
Electronic Component
Electronic Component
BM0264777493
Operating Temperature
40℃~+125℃
Operating Voltage
1.65V~5.5V
Logic Type
and Gate
Current(IOH)
32mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SN74LVC1G00DBVR 产品概述

一、简介

SN74LVC1G00DBVR(品牌:TECH PUBLIC / 台舟电子)是一款单单元 2 输入与非门(2-input NAND)逻辑器件,封装为 SOT-23-5,面向需要低功耗、高驱动能力以及宽工作电压范围的单片逻辑应用。器件内部集成掉电保护电路以及局部关断模式,便于在多电压域或节能场景中可靠使用。

二、核心参数与电气特性

  • 逻辑类型:与非门(NAND),功能表达式 Y = ¬(A · B)
  • 工作电压:1.65 V ~ 5.5 V(单电源供电)
  • 静态电流(Iq):典型 10 μA(低静态功耗,适合电池供电或待机场景)
  • 输出驱动能力:IOL = 32 mA、IOH = 32 mA(强输出能力,可直接驱动多数负载或下游逻辑输入)
  • 传播延迟(tpd):5.9 ns @ 5 V、CL = 15 pF(响应快速,适合中等速率信号链)
  • 工作温度范围:-40 ℃ ~ +125 ℃(工业级温度等级)
  • 输入通道数:2(双输入)
  • 系列:74LVC 家族(低电压互补 CMOS 逻辑)

三、功能说明与逻辑表

该器件在正逻辑下实现 NAND 功能,逻辑真值表如下:

  • A = 0, B = 0 → Y = 1
  • A = 0, B = 1 → Y = 1
  • A = 1, B = 0 → Y = 1
  • A = 1, B = 1 → Y = 0

器件适合作为基本组合逻辑构件,用于构建更复杂的逻辑功能或作为“glue logic”。

四、关键特性与保护

  • 掉电保护电路:器件内置掉电保护,能够在 Vcc 下降或断电时防止因输入仍受驱动而对芯片造成损害,提高系统容错性。
  • 局部关断模式:支持局部段的关断以降低闲置功耗,便于在多模块系统中按需断电,减少系统总体能耗。
  • 宽电压范围:1.65 V 至 5.5 V 的支持使其可在多种电源平台(如 1.8 V、2.5 V、3.3 V、5 V)中使用,但在跨域接口时仍需关注输入/输出电平兼容性。
  • 强劲驱动:高达 32 mA 的输出电流能力,能够驱动较大负载或多个下游输入,但长时间大电流输出需注意功耗与结温上升。

五、典型应用场景

  • 电源域之间的组合逻辑与接口电路(glue logic)
  • 工业控制、传感器接口中的逻辑决策单元
  • 便携设备和电池供电系统中的低功耗逻辑门
  • 时序电路、启停控制、复位/中断逻辑前端
  • 需要掉电保护或局部关断的系统级低功耗设计

六、封装与布局建议

  • 封装:SOT-23-5,适合小型化、表面贴装(SMT)应用。
  • 电源去耦:建议在 VCC 与 GND 之间放置 0.1 μF 陶瓷去耦电容,靠近器件电源引脚布置,以抑制瞬态噪声并保证稳定工作。
  • 热管理:尽管为低功耗 CMOS,但在持续高电流输出场景(接近 32 mA)下,应在 PCB 布局上留意散热路径与铜箔面积,以避免结温过高。
  • 引脚注意:典型 SOT-23-5 引脚包含 VCC、GND、A、B、Y。设计时请参考 TECH PUBLIC 的封装引脚图与 PCB 封装库,确认焊盘尺寸与阻焊开窗。

七、选型与使用建议

  • 在多电压系统中使用时,确认输入/输出电平和是否需要上/下拉以避免非确定性状态。
  • 若系统对静态功耗敏感,可利用器件的局部关断功能或在不需要时断电以进一步降低总功耗。
  • 在需要严格的 5 V 兼容输入时,查阅器件数据手册确认输入耐压和推荐连接方式(LVC 系列器件在某些条件下对高于 VCC 的输入电平敏感)。
  • 设计验证时建议在目标负载与实际温度环境下测量传播延迟与上/下拉能力,以确保满足时序和驱动要求。

如需详细数据手册(引脚图、典型电路、最高额定值及特性曲线)或样片信息,可联系 TECH PUBLIC(台舟电子)或查询官方文档以获得完整规格和应用参考。

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