WMSIC Electronic Components

TECH PUBLIC TPSGM7227YUWQ10G

ModelTPSGM7227YUWQ10G
PackageQFN-10L(1.4x1.8)
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC TPSGM7227YUWQ10G
Type
TECH PUBLIC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
TPSGM7227YUWQ10G
Electronic Component
1
Package
QFN-10L(1.4x1.8)
Electronic Component
550MHz
Electronic Component
Analog Switch / Multiplexer
Electronic Component
0.038g
Electronic Component
1
Channel Count
2
Features
Analog; Isolated
Electronic Component
BM0230027725
Operating Temperature
40℃~+85℃
Operating Voltage
1.5V~5.5V
Switch
2:1
(ton)
200ns

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TPSGM7227YUWQ10G 产品概述

一、产品简介

TPSGM7227YUWQ10G(品牌:TECH PUBLIC / 台舟电子)是一款高带宽、低导通电阻的双通道模拟开关器件。器件工作电压范围为1.5V~5.5V,工作温度范围为-40℃~+85℃,采用小型QFN-10L(1.4×1.8 mm)封装,适合空间受限和便携式系统中对模拟信号路由与切换的需求。产品描述标注为“未分类”,可视为通用型双2:1模拟开关。

二、主要特性

  • 2路通道、每路支持2:1切换(2:1 开关电路 ×2),可独立控制两路信号切换。
  • 工作电压:1.5V ~ 5.5V,兼容低电压电源与常见单电源系统。
  • 低导通电阻:Ron = 1.5Ω(VCC = 5V),在大多数模拟信号应用中保持较小的信号衰减与失真。
  • 快速开关性能:导通时间 ton ≈ 200 ns,关闭时间 toff ≈ 200 ns,适合中高速开关控制场景。
  • 低导通电容 Con = 7 pF,减少通道间串扰和对高频信号的负载影响。
  • 宽带宽:典型带宽达到550 MHz,有利于视频、射频或宽带模拟信号切换。
  • 工业级工作温度范围:-40℃~+85℃。

三、典型应用场景

  • 手持与便携式设备中的音频/视频信号路由与多路输入切换。
  • 仪器仪表中的多通道模拟信号选择(示波器前端、测试设备)。
  • 通用模拟多路开关:传感器信号路由、采集前端通道切换。
  • 需要较高带宽与低失真的高速模拟信号切换场合。

四、封装与机械信息

  • 封装类型:QFN-10L,小尺寸(1.4 × 1.8 mm),便于高密度PCB布局。
  • 推荐在PCB布局中为QFN底部热/地垫留焊盘并按厂商推荐的回流和焊盘尺寸设计,以保证可靠焊接与热散。
  • 垫片周围应留出适当的过孔和地回流路径,提升散热与电磁兼容性。

五、设计要点与注意事项

  • 电源与地:尽管为模拟开关,建议在VCC附近放置去耦电容(如0.1 μF)以抑制电源瞬态与噪声。
  • 信号完整性:带宽550 MHz及Con = 7 pF表明器件适合较高频信号,但长接线或大负载阻抗会降低系统带宽,布局时应尽量缩短信号走线并控制阻抗。
  • 开关时序:ton/toff ≈ 200 ns,若用于同步高速切换,应在系统时序中预留切换空档并避免在高频敏感测量时频繁切换。
  • 温度与功耗:在高温或靠近最大工作电压时,注意器件热管理,QFN底焊盘的良好热接地有助于散热。
  • ESD与保护:设计时依应用需要考虑输入保护,避免超过器件允许的输入电压范围(参照器件完整规格书确认绝对最大额定值)。

六、供货与选型建议

  • 封装与型号适合在空间受限、需高带宽和低Ron的模拟路由设计中替代通用模拟开关。
  • 选型时请结合完整的器件规格书确认输入电压、最大允许信号幅度及绝对最大额定值;如需差分信号或更低导通电阻的应用,可在系统级比较后决定。
  • 采购与参考:品牌为TECH PUBLIC(台舟电子),封装QFN-10L,建议向正规分销渠道索取器件数据手册和封装/焊盘建议以便最终PCB设计。

如需,我可根据您的实际电路(信号类型、源阻抗、负载、板级布局)给出更具体的布局建议和仿真要点。

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