Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TECH PUBLIC SMF3.3A
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TECH PUBLIC SMF3.3A
- Type
- TECH PUBLIC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TECH PUBLIC
- Electronic Component
- SMF3.3A
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- Electronic Component
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.037g
- Electronic Component
- 1
- Cj- Capacitor
- 1.9nF
- Electronic Component
- BM0230027724
- Voltage
- 7.3V
- Current(Ir)
- 50uA
- Voltage(VBR)
- 4.1V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMF3.3A 产品概述
一、产品简介
SMF3.3A 是由 TECH PUBLIC（台舟电子）提供的一款双向瞬变电压抑制二极管（TVS），封装为 SOD-123FL。该器件针对瞬态过电压和浪涌脉冲提供可靠钳位保护，适用于对电源轨与信号线的防护需求，尤其适合 3.3V 工作电压的系统。
二、主要电气参数
- 极性：双向
- 反向截止电压 Vrwm：3.3V
- 钳位电压 Vc（典型）：7.3V
- 击穿电压 Vbr：4.1V
- 峰值脉冲电流 Ipp：27A @ 10/1000µs
- 峰值脉冲功率 Ppp：200W @ 10/1000µs
- 反向电流 Ir：50µA
- 结电容 Cj：1900pF
这些参数表明该器件在标准 10/1000µs 浪涌条件下具有良好的吸收能量能力与钳位性能，同时正向/反向泄漏较小，适用于多数工业与消费类应用。
三、产品特性与优势
- 双向结构：可同时应对正向与反向瞬态，有利于交流或双向耦合线路保护。
- 高峰值吸收能力：200W（10/1000µs）能量吸收，适合短时大能量浪涌防护。
- 低漏电流：典型50µA，降低静态功耗与对系统偏置影响。
- 封装紧凑：SOD-123FL 适合空间受限的 PCB 布局，并便于自动贴片加工。
四、适用场景与限制
适用：3.3V 电源轨、接口保护（电源输入、传感器接口、工业控制模块）、汽车电子的低压防护等。
限制：结电容较大（1900pF），对高速差分或高频信号线（如高速 USB/PCIe/高速串行）会造成显著信号衰减或失真，不推荐用于对通道电容敏感的数据线。
五、布局与使用建议
- 尽量靠近受保护端口或连接器放置 TVS，缩短导线长度以降低串联感抗。
- 对于高速信号，可在 TVS 前增加串联阻抗或选择低电容类型器件。
- 考虑 PCB 热管理与通孔/外挂散热通道以帮助能量分散。
- 在并联应用中注意均流与布局对称性，避免因局部发热导致性能退化。
如需进一步的典型波形、浪涌测试曲线或器件封装图纸（PCD/封装尺寸），可提供后续资料或样片进行验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
