WMSIC Electronic Components

TECH PUBLIC SRV05-4HTG SRV05

ModelSRV05-4HTG
PackageSOT-23-6
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TECH PUBLIC SRV05-4HTG
Type
TECH PUBLIC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
SRV05-4HTG
Electronic Component
1
Package
SOT-23-6
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.034g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.35pF;0.8pF
Electronic Component
BM0227776275
Voltage
20V
Electronic Component
IEC 61000-4-4;IEC 61000-4-2
Current(Ir)
300nA
Voltage(VBR)
6V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SRV05-4HTG — 四路低容TVS瞬态抑制器(SOT-23-6)

一、产品概述

SRV05-4HTG 是 TECH PUBLIC(台舟电子)推出的一款四路 TVS(二极管)浪涌与静电放电保护器,专为 5V 工况的高速信号线和接口保护而设计。器件在反向工作电压 Vrwm = 5V 条件下可对电路提供可靠抑制,具有低结电容、低漏电和符合工业级抗扰度标准的特性,适用于 USB、通信接口、传感器总线及各类 5V 数字/模拟接口的 ESD/EFT 防护需求。

二、主要电气参数

  • 钳位电压(Vclamp):约 20V(在器件指定测试电流下)
  • 击穿电压(Vbr):6V(典型)
  • 反向截止电压 Vrwm:5V(适配 5V 系统)
  • 反向电流(Ir):≤ 300nA(在 Vrwm 条件下)
  • 结电容(Cj):0.35pF ~ 0.8pF(低电容设计,利于高速信号完整性)
  • 通道数:四路独立通道
  • 防护等级/标准:满足 IEC 61000-4-2(ESD)与 IEC 61000-4-4(EFT)要求
  • 封装:SOT-23-6,适合自动贴装与紧凑 PCB 布局

三、封装与实用特性

SRV05-4HTG 采用 SOT-23-6 小体积封装,四路保护通道集成,大幅节省 PCB 面积并简化器件选型。器件低结电容(0.35–0.8pF)使其在保持有效防护的同时对高速信号的影响最小,适配 USB2.0、UART、I2C、SPI 等对电容敏感的接口。

四、典型应用场景

  • USB 接口(D+/D- 及旁路信号的瞬态保护)
  • 工业与楼宇控制的数字 I/O 线防护(5V 标准)
  • 通信接口与传感器总线(串口、I2C、SPI)
  • 消费电子与移动设备的外部连接口防护
  • 医疗与测试设备中对瞬态事件(ESD/EFT)的本地抑制

五、设计与布局建议

  • 将 SRV05-4HTG 放置于需要保护的连接器或接口附近,保护点与被保护线之间走线尽量短且粗,减少寄生感抗。
  • 地(GND)回流路径应尽可能短且低阻,必要时靠近器件放置过孔连接至主地平面,避免长回流环路。
  • 在高频或精密模拟电路中,利用低结电容特性可直接并联于信号线与地之间;若系统对泄漏电流敏感,验证 300nA 的反向漏电对电路的影响。
  • 与串联阻抗(如小电阻或共模电感)配合使用时,可在浪涌事件中分担能量,提高整体保护能力。
  • 请参考厂商数据手册中关于焊接温度和热管理的具体说明,以保证可靠性。

六、选型理由与注意事项

SRV05-4HTG 适合需要在 5V 工作电压下为多路高速信号提供局部浪涌与静电保护的场合。其低结电容与四路集成的优势,有助于在不影响信号完整性的前提下实现成本与 PCB 面积的最优化配置。选型时应关注:钳位电压是否满足下游器件耐受值、反向漏电对系统待机功耗的影响,以及在具体浪涌/ESD 能量下的钳位特性。最终设计请以 TECH PUBLIC 官方数据手册与应用说明为准。

(备注:本文所列参数为常用值或典型值,具体电气特性与测试条件请以厂家 Datasheet 为准。)

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.