WMSIC Electronic Components

TECH PUBLIC AT8236-TP AT8236

ModelAT8236-TP
PackageESOP-8
BrandTECH PUBLIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
TECH PUBLIC AT8236-TP
Type
TECH PUBLIC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TECH PUBLIC
Electronic Component
AT8236-TP
Electronic Component
1
Package
ESOP-8
Electronic Component
0.149g
Electronic Component
1
Electronic Component
BM0266056970
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AT8236-TP 集成FET单H桥驱动芯片产品概述

一、产品定位与核心价值

AT8236-TP是台舟电子(TECH PUBLIC)推出的集成功率FET的单H桥驱动芯片,专为中小功率双向负载(如直流电机、螺线管)设计。其核心价值在于高集成度、低功耗、宽电压/温度范围,可简化电路设计、降低BOM成本,同时适配严苛的工业及汽车级应用场景,是小型驱动系统的理想选择。

二、关键参数深度解析

AT8236-TP的参数设计针对性强,覆盖多场景需求:

  1. 集成功率FET:内置完整H桥功率管,无需外接MOSFET,减少外部器件数量,缩小PCB面积,降低设计复杂度;
  2. 单H桥架构:支持负载双向驱动(如电机正反转、螺线管推拉),满足基本双向控制需求;
  3. 峰值电流3.6A:峰值负载能力达3.6A,持续电流可满足1.2A左右的中小功率负载(峰值通常为持续电流的2~3倍),适配多数小型直流电机;
  4. 宽工作电压6.5V~40V:覆盖12V汽车系统、24V工业控制及6~40V宽范围电源,兼容性强;
  5. 超低静态电流15uA:待机状态下仅消耗15微安电流,显著降低系统待机功耗,适合电池供电或长期待机的设备;
  6. 宽温范围-40℃~+125℃:符合工业级温度标准,可在极端环境(如低温户外、高温车间)稳定工作。

三、核心技术特性

AT8236-TP的技术特性围绕“高效、可靠、易集成”展开:

  • 高集成度设计:内置H桥及驱动逻辑,无需额外功率器件,电路仅需少量外围元件(如滤波电容)即可工作;
  • 低功耗待机优化:15uA静态电流远低于同类产品平均水平,有效延长电池续航(如便携式设备、无线控制终端);
  • 宽电压适应能力:6.5V启动电压兼容低电量电池,40V上限可承受电压波动(如汽车系统的瞬态电压);
  • 小封装ESOP-8:封装尺寸仅约3mm×3mm(典型ESOP-8规格),适合高密度PCB布局(如小型家电、车载电子模块)。

四、典型应用场景

AT8236-TP的参数匹配多领域需求,典型应用包括:

  1. 汽车电子:车窗升降电机、后视镜调节、座椅腰部支撑、小型油泵控制(兼容12V/24V系统);
  2. 工业控制:小型直流伺服电机驱动、螺线管电磁阀控制、小型传送带电机;
  3. 消费电子:智能家居窗帘电机、扫地机器人驱动轮、便携式打印机走纸电机;
  4. 安防设备:小型云台转动电机、门禁锁电磁控制、监控摄像头变焦驱动。

五、封装与可靠性

  • ESOP-8封装:采用表面贴装ESOP-8封装,散热性能满足峰值3.6A的短时负载需求,同时兼容自动贴装工艺,提高生产效率;
  • 宽温可靠性:-40℃~+125℃的工作温度范围,通过严苛的环境测试(如高低温循环、湿度测试),确保长期稳定工作;
  • 品牌保障:台舟电子(TECH PUBLIC)专注功率半导体领域多年,产品符合RoHS环保标准,品质可靠。

六、总结

AT8236-TP凭借集成FET、低静态电流、宽电压/温度范围、小封装等核心优势,成为中小功率双向驱动的高性价比选择。其适配汽车、工业、消费电子等多领域,可有效简化设计、降低成本,是工程师优化驱动电路的理想方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.